Abstract: A contact comprising an electrically conductive material plate defining a central planar contact base. A plurality of integral contact leaves extend spirally from the base, and a plurality of integral mounting tabs extend radially from the base. The leaves are mechanically deformed from the plane of the base to form independent spring contacts. The tabs are coplanar with the base. A metal plating containing interconnect particles is provided on the contact base and leaves.

Abstract: A plurality of discrete electronic devices contained for transport in a carrier, such as a tube or a tray, are precisely positioned upside down for simultaneous probing at a test site by a probe array that is brought into aligned abutment with the upwardly projecting device leads in a preciser that includes at least one row defined by at least two spaced parallel dividers, and a plurality of spaced parallel ridges oriented perpendicular to the dividers. The electronic devices are formed of a dielectric material joined to a conductive layer which is in aligned abutment with at least one device through at least one via in the dielectric material.

Abstract: A method and apparatus are provided for momentum plating. A nozzle directs a jet of a plating fluid to a workpiece surface, preferably oriented either below or lateral to the jet. The nozzle is formed surrounding an anode and the plating fluid passes either through or around the anode. The flow vector range of the jet impinges on the surface in a continuous fashion and without interruption at a region to be plated. Optionally, a first seal prevents the plating fluid from flowing across either a non-plated or a previously-plated area of the workpiece. The nozzle can be moved across the surface or, alternatively, the workpiece can be conveyed past a fixed nozzle. A patterned plated coating can be produced by varying the number and orientation of seals, the number of nozzles, the type of plating fluid, the angle of jet flow, and the rate and direction of the jet flow across the surface.

Abstract: A flexible conductive tape is coated on at least one surface with an electrically conductive adhesive. The adhesive includes conductive particles dispersed therein. The adhesive-coated surface of a first segment of the flexible tape is joined to a substrate. The flexible tape is folded back at a crease, to expose a portion of the adhesive surface. At least one module is affixed to the exposed adhesive surface of the adjacent tape segment to form a sub-assembly. The sub-assembly is adapted for interengagement with a complementary modular assembly including electrical components and connectors. An electrical current is provided to the flexible tape.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A patternable bonding material for joining the surfaces of two or more substrates permits localization of conductive or insulating hard-cored particles within an adhesive matrix to form patterned structures on or between the surfaces. Electrical, thermal, or mechanical energy may be transferred through, or isolated by the material. The material may be used in an uncured state to allow easy separation of the joined surfaces, or a more permanent bond may be formed. The adhesive may be cured by thermocuring, evaporation or ablation of organic components, pressure, or by the application of ultraviolet radiation.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to whereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material, which are useful in batteries fuel cells and capacitors.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when the contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A temporary electrical junction includes a first electrical contact having a first metal surface; a second electrical contact having a second metal surface; and a plurality of particulate cores having a hardness greater than that of the first and second metal surfaces, the particulate cores being disposed between the first and second contacts. Force is applied to the first and second contacts such that the particulate cores cause elasto-plastic deformation of at least one of the first and second surfaces, such that the first and second contacts are temporarily joined together at least partly along their respective metal surfaces to complete the electrical junction.

Abstract: A method for joining a first metal surface to a second metal surface employs metallized particles or protuberances disposed between said surfaces. The metallized particles include a core particulate composed of a material having a hardness greater than that of the metals to be bonded. By compressing the metal surfaces together in a generally normal or perpendicular direction, one or both of the metal surfaces is compressed into a metal region formed around the particulate core. In this way, very high local regions of stress are created which cause the metal to elastoplastically deform, enhancing the ability to form diffusion bonds. Alternatively, temporary electrical or other junctions may be formed by bringing the surfaces together under less rigorous conditions and/or using metals which are incapable of forming diffusion bonds.

Abstract: The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.