Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: An adhesive article comprises a backing having opposed top and bottom surfaces and a layer of a pressure sensitive adhesive on the bottom surface. The pressure sensitive adhesive comprises selected poly-.alpha.-olefin polymers and a cold flow restricting agent. The adhesive articles are especially useful for protecting motor vehicles from damage during manufacture, transport and storage.

Abstract: Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive .alpha.-cleaving groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers in situ or be added thereto to form the syrup.

Abstract: Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive hydrogen abstracting groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers.

Abstract: This invention relates to a process in which a composition is coated onto a substrate and crosslinked so as to form a PSA by means of polymerizing free radically polymerizable monomers from covalently attached pendent unsaturation in the polymer component of the composition. The coating can carried out by a wide variety of industrial methods because the process of the invention allows for compositions with a wide degree of possible viscosities.

Abstract: The invention provides novel acrylamide functional disubstituted acetyl aryl ketones and a process for their preparation in high yields uncontaminated by difunctional material. The invention further provides photocrosslinkable compositions comprising one or more ethylenically-unsaturated monomers and as photoinitiator the acrylamide functional disubstituted acetyl aryl ketone of the invention. The compositions are useful for the preparation of films and coatings, particularly pressure-sensitive adhesive coatings.

Abstract: The novel fast-drying pressure-sensitive adhesives comprises a polymer of a terminally unsaturated vinyl monomer such as isooctyl acrylate and an emulsifier monomer such as sodium styrene sulfonate plus a phosphate emulsifier, especially certain polyoxyethylene phosphates or salts thereof. Pressure-sensitive adhesive tapes comprise a backing and the novel adhesive. The novel tape is particularly useful as an automotive masking tape, because it both aheres strongly and can be cleanly removed from automotive paints after typical baking cycles. As compared to prior tapes the novel tapes have equal or better adhesive performance, i.e., at least 35 N/dm of peel adhesion, with a faster drying adhesive layer. The tapes can, therefore, be produced more economically. Furthermore, the adhesive bubbling problem formerly seen with paper backings is eliminated.

Abstract: The pressure-sensitive adhesive layer of the novel tape, like that of Silver U.S. Pat. No. 3,922,464, comprises a copolymer of alkyl acrylate such as isooctyl acrylate and a small amount of emulsifier monomer. The novel tape differs from that of Silver by incorporating tackifier resin, thus better resisting lifting forces at elevated temperatures while also being cleanly removable.

Abstract: The adhesive layer of the novel pressure-sensitive adhesive tape comprises a polymer of a terminally unsaturated vinyl monomer such as isooctyl acrylate and an emulsifier monomer such as sodium styrene sulfonate. Preferably, the adhesive layer also contains a small amount of a noncationic external emulsifier such as sodium dodecylbenzene sulfonate. Although the tape has excellent adhesive properties, it is removable from a variety of surfaces after one hour at 120.degree. C. and so is useful for purposes such as automotive masking tape.

Abstract: Normally tacky and pressure-sensitive adhesive tape, having a composite adhesive stratum made of 2 or more separate layers in which the tape synergistically exhibits properties superior to those of a tape made with either component layer alone. One layer is a polyurethane having some adhesive properties but lacking true pressure-sensitivity. The exposed surface of the stratum is a conventional pressure-sensitive adhesive. Numerical criteria are specified for each layer.