Abstract: An improved laser printer or photocopier toner for authentication is made by mixing conventional toner particles with submicron ultraviolet sensitive particles that exhibit detectable characteristics in response to ultraviolet radiation. A document printed using the improved toner can be authenticated using a UV scanner.

Abstract: A release agent is first applied to a target article and on top of the release agent is applied an ultraviolet radiation fluorescent material to enable fraud detection. To prevent fraud, a security label may also be used comprising a label substrate, a release layer, a layer of ultraviolet radiation fluorescent material, and an adhesive layer for adhering to a target article. When the substrate is peeled off, part of the ultraviolet sensitive material will be peeled off also to enable detection.

Abstract: An integrated circuit package characterized by an interposer including a thin, flexible, planar insulator having a plurality of substantially radial traces provided on one side thereof. The other side of the insulator is attached to the die attach pad of a lead frame, and an integrated circuit die is attached within a die attach area of the assembly. A first set of wires couples bonding pads of the die to the traces, and a second set of wires couples the traces to bonding fingers of the lead frame. The bonding fingers, interposer, die, and both sets of wires are then encapsulated in plastic. The interposer can be advantageously manufactured in a tape automated bonding (TAB) process to provide a low cost, high performance, and versatile lead frame assembly.

Abstract: A semiconductor device package is disclosed which facilitates the dissipation of heat generated by the enclosed semiconductor device. The package comprises a housing apparatus having a plurality of portions, a holding apparatus having a semiconductor device thermally attached, a thermal path formed within at least one of the portions of the housing apparatus, and a thermally conductive connection for thermally connecting the holding apparatus to the thermal path. The portions of the housing apparatus join together to form an enclosed chamber which encases the holding apparatus, the semiconductor device, and the thermally conductive connection. The thermal path thermally connects the interior of the package to the external environment. By thermally connecting the holding apparatus to the thermal path formed within the housing apparatus, a direct thermal path is created between the device and the external environment so that heat from the device may readily escape from the interior of the package.