Abstract: A phased array antenna includes a semiconductor wafer, with radio frequency (RF) circuitry fabricated on top side of the semiconductor wafer. There is an array of antenna elements above the top side of the semiconductor wafer, and a coaxial coupling arrangement coupling the RF circuitry and the array of antenna elements. The coaxial coupling arrangement may include a plurality of coaxial connections, each having an outer conductor, an inner conductor, and a dielectric material therebetween. The dielectric material may be air.

Abstract: A phased array antenna includes a semiconductor wafer, with radio frequency (RF) circuitry fabricated on top side of the semiconductor wafer. There is an array of antenna elements above the top side of the semiconductor wafer, and a coaxial coupling arrangement coupling the RF circuitry and the array of antenna elements. The coaxial coupling arrangement may include a plurality of coaxial connections, each having an outer conductor, an inner conductor, and a dielectric material therebetween. The dielectric material may be air.

Abstract: The present invention can provide an optical backplane assembly including a structural member for supporting a plurality of optical backplane connectors and a plurality of fiber-optic fabric inter-connectors. Each one of the plurality of fiber-optic fabric inter-connectors can include a substantially flat body portion having legs extending outward from the body portion. Each of the legs can include at least one optical fiber bundle disposed therein and an optical fiber connector for cooperatively engaging selected ones of the plurality of optical backplane connectors. Notably, the body portions of the plurality of fiber-optic fabric inter-connectors can be stacked so as to at least partially overlap one another.

Abstract: The present invention can provide an optical backplane assembly including a structural member for supporting a plurality of optical backplane connectors and a plurality of fiber-optic fabric inter-connectors. Each one of the plurality of fiber-optic fabric inter-connectors can include a substantially flat body portion having legs extending outward from the body portion. Each of the legs can include at least one optical fiber bundle disposed therein and an optical fiber connector for cooperatively engaging selected ones of the plurality of optical backplane connectors. Notably, the body portions of the plurality of fiber-optic fabric inter-connectors can be stacked so as to at least partially overlap one another.

Abstract: An optical interconnect module includes a pair of rectangular configured circuit boards spaced in close proximity to each other and each having an outer circuit carrying side. An inner plenum is defined between the boards and the boards form an open end. A mounting member engages the circuit boards and secures the boards together to form a module. Electronic components are mounted on the outer circuit carrying sides and a cooling core is mounted within the inner plenum and engages the circuit boards for cooling the electronic components mounted on the circuit boards as coolant is passed through the cooling core. An optoelectronic transducer assembly is mounted at the open end of the module and operatively connected to a circuit carrying side of one of the circuit boards. The cooling core engages the optoelectronic transducer assembly to provide cooling to the transducer assembly. An optical fiber is mounted in communication with the optoelectronic transducer assembly at the open end of the module.