Abstract: In a charged-particle-beam lithographic system, charge accumulation on the workpiece during alignment or writing can cause significant pattern placement errors. A film (16) formed directly under the resist layer (56) to be patterned is utilized as a charge-conducting medium during lithography. The pattern delineated in the resist layer (56) is transferred into the film (16) and subsequently into an underlying layer (20). The film (16) is highly compatible with standard lithographic and etching processes used to fabricate LSI and VLSI circuits.

Abstract: In one embodiment, a relatively thin layer of polysilicon is deposited on an underlying region to which spaced-apart electrical contacts are to be made through a subsequently formed relatively thick insulating layer. The polysilicon is selectively masked by a patterned silicon nitride layer in the regions where contact windows are to be formed. The unmasked polysilicon is then converted to a relatively thick insulating layer in an oxidizing step. Thereafter the silicon nitride portions are removed and the remaining polysilicon is utilized to provide conductive regions in the defined windows. In another embodiment, a relatively thick layer of polysilicon is selectively masked and partially converted to silicon dioxide to define both the insulating layer and the conductive regions. In still another embodiment, a relatively thin layer of polysilicon is patterned and then entirely converted to silicon dioxide to form an insulating layer having windows defined therein.