Patents by Inventor Louis Rector
Louis Rector has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230321765Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.Type: ApplicationFiled: June 2, 2023Publication date: October 12, 2023Inventors: Pukun Zhu, Shashi Gupta, Louis Rector, Qizhuo Zhuo
-
Patent number: 11745294Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.Type: GrantFiled: November 3, 2017Date of Patent: September 5, 2023Assignee: HENKEL AG & CO., KGaAInventors: Pukun Zhu, Shashi Gupta, Louis Rector, Qizhuo Zhuo
-
Publication number: 20180056449Abstract: Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.Type: ApplicationFiled: November 3, 2017Publication date: March 1, 2018Inventors: Pukun ZHU, Shashi GUPTA, Louis RECTOR, Qizhuo ZHUO
-
Patent number: 7034652Abstract: The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.Type: GrantFiled: July 10, 2002Date of Patent: April 25, 2006Assignee: Littlefuse, Inc.Inventors: Stephen J. Whitney, Hugh Hyatt, Louis Rector
-
Patent number: 6693508Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members.Type: GrantFiled: February 9, 2000Date of Patent: February 17, 2004Assignee: Littelfuse, Inc.Inventors: Stephen J. Whitney, Louis Rector, Hugh M. Hyatt, Anthony D. Minervini, Honorio S. Luciano
-
Patent number: 6549114Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members.Type: GrantFiled: August 19, 1999Date of Patent: April 15, 2003Assignee: Littelfuse, Inc.Inventors: Stephen J. Whitney, Louis Rector, Hugh M. Hyatt, Anthony D. Minervini, Honorio S. Luciano
-
Publication number: 20030025587Abstract: The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.Type: ApplicationFiled: July 10, 2002Publication date: February 6, 2003Inventors: Stephen J. Whitney, Hugh Hyatt, Louis Rector
-
Publication number: 20030020590Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members.Type: ApplicationFiled: February 9, 2000Publication date: January 30, 2003Inventors: Stephen J. Whitney, Louis Rector, Hugh M. Hyatt, Anthony D. Minervini, Honorio S. Luciano
-
Publication number: 20020050910Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members.Type: ApplicationFiled: August 19, 1999Publication date: May 2, 2002Inventors: STEPHEN J. WHITNEY, LOUIS RECTOR, HUGH M. HYATT, ANTHONY D. MINERVINI, HONORIO S. LUCIANO
-
Patent number: 6251513Abstract: A composition and devices utilizing these compositions for providing protection against electrical overstress including a matrix formed of a mixture of an insulating binder, conductive particles having an average particle size of less than 10 microns, and semiconductive particles having an average particle size of less than 10 microns. The compositions exhibit improved clamping voltages in a range of about 30 volts to greater than 2,000 volts.Type: GrantFiled: August 19, 1998Date of Patent: June 26, 2001Assignee: Littlefuse, Inc.Inventors: Louis Rector, Hugh M. Hyatt
-
Patent number: 6191928Abstract: The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device.Type: GrantFiled: February 23, 1999Date of Patent: February 20, 2001Assignee: Littelfuse, Inc.Inventors: Louis Rector, Hugh M. Hyatt, Anthony Minervini, Robert Swensen, Andrew J. Neuhalfen, Andrew W. S. Elliott