Patents by Inventor Louis Richard Semff

Louis Richard Semff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6063327
    Abstract: A method of making a shaped article and composite therefor which includes of a shaped tool, such as a mold and providing a composite of a quartz fabric disposed within a polysilazane which is moldable at a temperature below the curing temperature of the polysilazane and cured by catalyst. The polysilazane can be optionally filled with particulate material. A compaction pressure is applied to the composite to insure contact of the composite and the tool and prevent loss of less reactive polysilazane components. The composite is then cured to hardness by increasing the temperature applied to the composite at a rate of about 10.degree. C./minute to a temperature of about 150.degree. C. and holding that temperature of about 150.degree. C. up to about 4 hours to provide a cured polymer. The cured composite is removed from the tool. The polymer can then be converted to a preceramic by heating the cured polymer to a temperature sufficiently high in an inert atmosphere or ammonia gas for a sufficient time.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: May 16, 2000
    Assignee: Raytheon Company
    Inventor: Louis Richard Semff
  • Patent number: 5948348
    Abstract: A method of making a shaped article and composite therefor which comprises of a shaped tool, such as a mold and providing a composite of a quartz fabric disposed within a resin taken from the class consisting of inorganic silicon-based polymers, preferably polycarbosilanes having predominantly hydrogen and/or methyl groupings attached thereto and polysilanes having hydrogen and/or methyl grouping attached thereto, polycarbosilazanes, polyborosilazanes, polyborosilanes and certain polysiloxanes with attached groupings as noted for the similar materials as set forth above, which is moldable at a temperature below the curing temperature of the resin and cured by catalyst. The resin can be optionally filled with particulate material. A compaction pressure is applied to the composite to insure contact of the composite and the tool and prevent loss of less reactive resin components. The composite is then cured to hardness by increasing the temperature applied to the composite at a rate of about 10.degree. C.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: September 7, 1999
    Assignee: Raytheon Company
    Inventor: Louis Richard Semff