Patents by Inventor Louis S. Perko

Louis S. Perko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure transfer plate assembly for a heat bonding apparatus
    Patent number: 4875966
    Abstract: An improved pressure transfer plate assembly is provided for an apparatus to heat bond flexible printed circuits in a hydraulic press. The plate assembly comprises aluminum top and bottom plates with two or more thin sheet liners in between. A plurality of workpiece-locating pins are based in stainless steel plug inserts in the bottom plate to give excellent wear resistance. The alignment of top and bottom plates is effected by a plurality of plate-alignment pins screwed into the bottom plate and having slotted head portions to allow for easy removal and installation.
    Type: Grant
    Filed: September 12, 1988
    Date of Patent: October 24, 1989
    Assignee: General Dynamics Corp., Pomona Div.
    Inventor: Louis S. Perko