Abstract: An integrated circuit (“IC”) package comprises a first semiconductor die and a second semiconductor die. The second semiconductor die is coupled to the first semiconductor die within the same IC package. The first semiconductor die includes an interface to memory and the first and second semiconductor dies share said memory. The memory may be located outside or inside the IC package containing the first and second semiconductor dies. In another embodiment, a system comprises a first IC package containing a memory die and a second IC package coupled to the first IC package. The second IC package contains a die stack comprising first and second dies coupled together. The first die includes an interface to the memory die and both of the dies in the die stack share access to the memory die. The system may comprise a communication system such as a cellular telephone.

Abstract: Video graphics display system having a display adapter connected between a host processor (2) and a display unit (6). The display adapter includes a video memory (4) which has first and second memory parts (3) and (8). A graphics processor (1) is connected between the host processor and the first memory part (3) of the video memory (4) which is operably connected to the display unit. The second memory part (8) of the video memory (4) is connected to a logic based hardware sub-system (7), the logic based hardware sub-system being further connected to the host processor. The host processor effectively provides software and hardware compatible applications associated with the graphics processor and the logic based hardware sub-system for implementation as display data stored in the first and second memory parts of the video memory. The display unit may provide a display based upon the memory content of either the first or the second memory part of the video memory, or a combination of both memory parts.