Patents by Inventor Louis Vervoort

Louis Vervoort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device
    Patent number: 8021919
    Abstract: A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a substrate. A foil is held over the chip and the carrier or the substrate. A laser beam is directed onto the foil, and substance at the foil is ablated and deposited on the chip and the carrier or on the substrate.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: September 20, 2011
    Assignee: Infineon Technologies AG
    Inventors: Manfred Mengel, Thomas Spoettl, Frank Pueschner, Louis Vervoort
  • Integrated circuit including gas phase deposited packaging material
    Patent number: 7982309
    Abstract: An integrated circuit includes a substrate including an active area and a gas phase deposited packaging material encapsulating the active area.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: July 19, 2011
    Assignee: Infineon Technologies AG
    Inventors: Louis Vervoort, Joachim Mahler
  • Electronic device
    Patent number: 7968378
    Abstract: One embodiment provides a method of manufacturing semiconductor devices. For example, a sawn and expanded wafer is utilized having dielectrical material deposited between the diced and deposited chips. The method includes placing at least two chips on a metallic layer, depositing mold material on the metallic layer and between the chips, and selectively removing a portion of the mold material from the metallic layer to selectively expose a portion of the metallic layer. The method additionally includes covering the selectively exposed portion of the metallic layer with a conductive material, and singulating the at least two chips.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: June 28, 2011
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Edward Fuergut, Louis Vervoort
  • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20110003440
    Abstract: A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a substrate. A foil is held over the chip and the carrier or the substrate. A laser beam is directed onto the foil, and substance at the foil is ablated and deposited on the chip and the carrier or on the substrate.
    Type: Application
    Filed: March 31, 2009
    Publication date: January 6, 2011
    Applicant: Infineon Technologies AG
    Inventors: Manfred Mengel, Thomas Spoettl, Frank Pueschner, Louis Vervoort
  • ELECTRONIC DEVICE
    Publication number: 20090194882
    Abstract: One embodiment provides a method of manufacturing semiconductor devices. For example, a sawn and expanded wafer is utilized having dielectrical material deposited between the diced and deposited chips. The method includes placing at least two chips on a metallic layer, depositing mold material on the metallic layer and between the chips, and selectively removing a portion of the mold material from the metallic layer to selectively expose a portion of the metallic layer. The method additionally includes covering the selectively exposed portion of the metallic layer with a conductive material, and singulating the at least two chips.
    Type: Application
    Filed: February 6, 2008
    Publication date: August 6, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Edward Fuergut, Louis Vervoort
  • INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT
    Publication number: 20090032871
    Abstract: An integrated circuit includes a substrate including an active area, a first metal contact contacting a frontside of the active area, a second metal contact contacting a backside of the active area, and a wafer-level deposited metal structure positioned adjacent to an edge of the active area and interconnecting the first and second contacts.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 5, 2009
    Inventors: Louis Vervoort, Joachim Mahler