Patents by Inventor Louis W. Nicholls
Louis W. Nicholls has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11876039Abstract: In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side with a coupling structure so that the first component terminals and the second component terminals face opposite directions. Interconnects are connected to the conductive structure. The second component terminals and the interconnects are configured for connecting to a next level assembly. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 11, 2022Date of Patent: January 16, 2024Assignee: Amkor Technol Singapore Holding Pte. Ltd.Inventors: Roger D. St. Amand, Louis W. Nicholls
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Patent number: 11488892Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: GrantFiled: July 13, 2020Date of Patent: November 1, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Publication number: 20220319969Abstract: In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side with a coupling structure so that the first component terminals and the second component terminals face opposite directions. Interconnects are connected to the conductive structure. The second component terminals and the interconnects are configured for connecting to a next level assembly. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 11, 2022Publication date: October 6, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Roger D. ST. AMAND, Louis W. NICHOLLS
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Publication number: 20220189866Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: ApplicationFiled: August 9, 2021Publication date: June 16, 2022Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Patent number: 11362027Abstract: In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side so that the first component terminals and the second component terminals face opposite directions. Substrate interconnects are connected to the conductive structure, and a bottom encapsulant covers the substrate bottom side, the first electronic component, the second electronic component, and the substrate interconnects.Type: GrantFiled: February 28, 2020Date of Patent: June 14, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Roger D. St. Amand, Louis W. Nicholls
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Publication number: 20210272887Abstract: In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side so that the first component terminals and the second component terminals face opposite directions. Substrate interconnects are connected to the conductive structure, and a bottom encapsulant covers the substrate bottom side, the first electronic component, the second electronic component, and the substrate interconnects.Type: ApplicationFiled: February 28, 2020Publication date: September 2, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Roger D. St. Amand, Louis W. Nicholls
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Patent number: 11088064Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: GrantFiled: September 16, 2019Date of Patent: August 10, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Publication number: 20210166992Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: ApplicationFiled: July 13, 2020Publication date: June 3, 2021Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Patent number: 10714408Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: GrantFiled: April 2, 2019Date of Patent: July 14, 2020Assignee: AMKOR TECHNOLOGY, INC.Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Publication number: 20200219802Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: ApplicationFiled: September 16, 2019Publication date: July 9, 2020Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Publication number: 20190371706Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: ApplicationFiled: April 2, 2019Publication date: December 5, 2019Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Patent number: 10418318Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: GrantFiled: February 14, 2019Date of Patent: September 17, 2019Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Patent number: 10347562Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: GrantFiled: July 28, 2017Date of Patent: July 9, 2019Assignee: Amkor Technology, Inc.Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Patent number: 10224270Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: GrantFiled: October 3, 2016Date of Patent: March 5, 2019Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Patent number: 9721872Abstract: A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.Type: GrantFiled: February 16, 2012Date of Patent: August 1, 2017Assignee: AMKOR TECHNOLOGY, INC.Inventors: Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert F. Darveaux
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Patent number: 9462690Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: GrantFiled: August 9, 2013Date of Patent: October 4, 2016Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Patent number: 8536458Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.Type: GrantFiled: March 30, 2009Date of Patent: September 17, 2013Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
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Patent number: 5864776Abstract: A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing process. This takes place prior to injection of an initially molten material that solidifies and encapsulates the small objects upon curing and cooling.Type: GrantFiled: August 27, 1997Date of Patent: January 26, 1999Assignee: Mitsubishi Electric America, Inc.Inventors: Waite R. Warren, Jr., John T. Cox, Louis W. Nicholls
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Patent number: 5788829Abstract: A method and apparatus for electroplating a workpiece to achieve a uniform plating thickness includes a cathode rack having a hook from which the workpiece is suspended and spaced apart from a consumable anode. The rack includes a plurality of plates made of the same material as the anode disposed on opposite sides of the rack. The plates direct a portion of the current emanating from the anode away from the workpiece to produce more uniform plating.Type: GrantFiled: October 16, 1996Date of Patent: August 4, 1998Assignee: Mitsubishi Semiconductor America, Inc.Inventors: Swati V. Joshi, Robert R. Botts, Louis W. Nicholls
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Patent number: 5776327Abstract: A method and apparatus are provided for electroplating a workpiece. The apparatus includes an anode basket containing particles of an electroplating material. A mask is positioned around the anode basket to selectively block current flow from the basket to the workpiece which is mounted to a cathode. The mask includes a frame supporting a number of non-conductive plates adjusted in position to provide a desired electrical field distribution. The resulting electrical field between the anode and the cathode produces uniform plating thickness over the entire surface of the workpiece.Type: GrantFiled: October 16, 1996Date of Patent: July 7, 1998Assignee: Mitsubishi Semiconuctor Americe, Inc.Inventors: Robert R. Botts, Swati V. Joshi, Louis W. Nicholls