Patents by Inventor Lourdito OLLERES

Lourdito OLLERES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded device with anti-delamination structure providing multi-layered compression forces
    Patent number: 9397053
    Abstract: The present invention provides a molded encapsulated multi-layered semiconductor device, comprising a first substrate, a second substrate and an anti-delamination structure (ADS). The ADS comprises a connecting part and extended structures, and is filled by an insulating material. The present invention is able to provide the molded semiconductor device with higher reliability and longer lifetime through reduction of shear stress generated from the coefficient of thermal expansion mismatch between a silicon die and the substrates by mechanically locking with the ADS.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: July 19, 2016
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Lourdito Olleres, Yueping Ye, Man Kai Cheung
  • Molded Device with Anti-delamination Structure Providing Multi-layered Compression Forces
    Publication number: 20160111377
    Abstract: The present invention provides a molded encapsulated multi-layered semiconductor device, comprising a first substrate, a second substrate and an anti-delamination structure (ADS). The ADS comprises a connecting part and extended structures, and is filled by an insulating material. The present invention is able to provide the molded semiconductor device with higher reliability and longer lifetime through reduction of shear stress generated from the coefficient of thermal expansion mismatch between a silicon die and the substrates by mechanically locking with the ADS.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 21, 2016
    Inventors: Lourdito OLLERES, YUEPING YE, Man Kai CHEUNG