Patents by Inventor Lovell Harold Camnitz

Lovell Harold Camnitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bulk acoustic resonator devices and processes for fabricating bulk acoustic resonator devices
    Patent number: 10181835
    Abstract: In a bulk acoustic resonator device, at least one additional metal feature is formed on a top surface of the bottom electrode at a location at which the bottom electrode electrical contact will subsequently be formed, thereby thickening the metal at the location below where the piezoelectric material layer will be etched to form the opening for the bottom electrode electrical contact. Consequently, even though some of the metal of the additional metal feature and/or of the bottom electrode will be removed during the process of etching the opening in the piezoelectric material layer, the bottom electrode will always retain sufficient thickness after the piezoelectric material layer is etched.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: January 15, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: David Thomas Martin, Keri Liane Williams, Sean Hansen, Lori Ann Callaghan, Lovell Harold Camnitz, Alexia Polland Kekoa, Kun Wang, Bernhard Ulrich Koelle
  • BULK ACOUSTIC RESONATOR DEVICES AND PROCESSES FOR FABRICATING BULK ACOUSTIC RESONATOR DEVICES
    Publication number: 20170346462
    Abstract: In a bulk acoustic resonator device, at least one additional metal feature is formed on a top surface of the bottom electrode at a location at which the bottom electrode electrical contact will subsequently be formed, thereby thickening the metal at the location below where the piezoelectric material layer will be etched to form the opening for the bottom electrode electrical contact. Consequently, even though some of the metal of the additional metal feature and/or of the bottom electrode will be removed during the process of etching the opening in the piezoelectric material layer, the bottom electrode will always retain sufficient thickness after the piezoelectric material layer is etched.
    Type: Application
    Filed: May 31, 2016
    Publication date: November 30, 2017
    Inventors: David Thomas Martin, Keri Liane Williams, Sean Hansen, Lori Ann Callaghan, Lovell Harold Camnitz, Alexia Polland Kekoa, Kun Wang, Bernhard Ulrich Koelle