Patents by Inventor Low Boon Yew

Low Boon Yew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Side vented pressure sensor device
    Patent number: 9040335
    Abstract: A semiconductor sensor device has a pressure sensing die and at least one other die mounted on a substrate, and electrical interconnections that interconnect the pressure sensing die and the at least one other die. An active region of the pressure sensing die is covered with a pressure sensitive gel material, and a cap having a cavity is mounted over the pressure sensing die such that the pressure sensing die is positioned within the cavity. The cap has a side vent hole that exposes the gel covered active region of the pressure sensing die to ambient atmospheric pressure outside the sensor device. Molding compound on an upper surface of the substrate encapsulates the at least one other die and at least a portion of the cap.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: May 26, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Low Boon Yew, Chee Seng Foong, Teck Beng Lau