Patents by Inventor Low Hong Yeap

Low Hong Yeap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB interconnect scheme for co-planar LED strips
    Patent number: 11396985
    Abstract: LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: July 26, 2022
    Assignee: Illumina, Inc.
    Inventors: Brian Elliot Sinofsky, Michael Justin Wright, Lim Peng Huay, Low Hong Yeap, Voon Yeow Seng
  • PCB INTERCONNECT SCHEME FOR CO-PLANAR LED STRIPS
    Publication number: 20210071830
    Abstract: LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 11, 2021
    Inventors: Brian Elliot Sinofsky, Michael Justin Wright, Lim Peng Huay, Low Hong Yeap, Voon Yeow Seng