Patents by Inventor Lowell H. Holschwandner

Lowell H. Holschwandner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tungsten metallization
    Patent number: 5227335
    Abstract: The adhesion of tungsten to an underlying dielectric layer is improved by the use of a thin glue layer of either TiN or Al.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: July 13, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Lowell H. Holschwandner, Virendra V. S. Rana