Abstract: A device for connecting an integrated circuit to a circuit board having a body of insulating material with a first surface adapted to fit flush against a circuit board, a second surface adjacent the first surface having a series of parallel grooves, and a third surface. Each of a series of parallel conductors is molded into a central portion of the body of insulating material and is bent to fit into one of the grooves in a manner that the insulating material underlying the bend is forced tightly thereagainst and the portion of the body which is grooved is forced tightly against the remaining portion of the conductor. The conductors protrude at one end from the first surface for connection to a circuit board and at the other end lie alongside the third surface and are bent to provide a spring to hold and make contact with a leadless flat circuit interposed between the conductors and the third surface.

Abstract: A connector with an integral ground plane for making connections between two circuit boards is disclosed in which the connector has a bar-shaped body including generally C-shaped contacts extending in a row on opposite sides of the body. A ground plane in the form of a thin conductive sheet is positioned in the body between the rows, and has a predetermined pattern of projections which are bent to contact specific ones of the C-shaped contacts when the connector is assembled between the two circuit boards.