Patents by Inventor lsao SUGAYA

lsao SUGAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
    Publication number: 20190267238
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, lsao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, lkuhiro KUWANO