Patents by Inventor LSI Logic Corporation

LSI Logic Corporation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and means for wave soldering of leads of an integrated circuit package
    Patent number: 4766842
    Abstract: Solder coating of lead of IC packages is accomplished by passing IC packages on a pallet through a solder wave. The rectangular or square IC packages are positioned so that they are tilted relative to the horizontal and rotated so that a side or adjacent sides of the package enter and exit the solder wave at an angle that is not 90.degree. or 180.degree..
    Type: Grant
    Filed: April 29, 1987
    Date of Patent: August 30, 1988
    Inventors: Jon Long, LSI Logic Corporation