Abstract: There is provided a method for etching magnetic tunnel junction, using an etching apparatus including a sample loading chamber, a vacuum transition chamber, a reactive ion plasma etching chamber, an ion beam etching chamber, a coating chamber, and a vacuum transmission chamber. The method completes the etching of the magnetic tunnel junction in the reactive ion plasma etching chamber, performs ion beam cleaning in the ion beam etching chamber, and performs coating protection in the coating chamber. The transmission among the respective chambers is all in a vacuum state. The invention can overcome the bottleneck in the production of high-density small devices, while greatly improving the yield, reliability and production efficiency of the devices.

Abstract: An array substrate, a repair method of the array substrate, a display panel and a display device are provided. The array substrate includes a base substrate, and a common electrode layer, a common electrode line mesh, a first metal layer and a second metal layer which are on the base substrate, and the common electrode line mesh is electrically connected with the common electrode layer. The first metal layer includes a first signal line extending along a first direction; the second metal layer includes a second signal line extending along a second direction and a plurality of repair connection portions; and each repair connection portion has a first overlap portion overlapping the first signal line and a second overlap portion overlapping the common electrode line mesh.

Abstract: The embodiments of the present disclosure propose an array substrate, a display apparatus, and a maintaining method. The array substrate comprises: a first signal line disposed in a first direction; a second signal line disposed in a second direction different from the first direction; and a maintaining part disposed adjacent to an intersection region of the first signal line which overlaps with the second signal line, electrically connected to a common electrode line, and is electrically insulated from the first signal line.

Abstract: The embodiments of the present disclosure propose an array substrate, a display apparatus, and a maintaining method. The array substrate comprises: a first signal line disposed in a first direction; a second signal line disposed in a second direction different from the first direction; and a maintaining part disposed adjacent to an intersection region of the first signal line which overlaps with the second signal line, electrically connected to a common electrode line, and is electrically insulated from the first signal line.

Abstract: An array substrate, a repair method of the array substrate, a display panel and a display device are provided. The array substrate includes a base substrate, and a common electrode layer, a common electrode line mesh, a first metal layer and a second metal layer which are on the base substrate, and the common electrode line mesh is electrically connected with the common electrode layer. The first metal layer includes a first signal line extending along a first direction; the second metal layer includes a second signal line extending along a second direction and a plurality of repair connection portions; and each repair connection portion has a first overlap portion overlapping the first signal line and a second overlap portion overlapping the common electrode line mesh.

Abstract: A pixel unit includes a thin film transistor, a first insulating layer, a pixel electrode, a second insulating layer, a meltable conductive component, and a common electrode. The thin film transistor includes a drain electrode. The first insulating layer is arranged over the drain electrode. The pixel electrode is arranged over the first insulating layer and electrically coupled to the drain electrode. The second insulating layer is arranged over the pixel electrode. The meltable conductive component is arranged over the second insulating layer. The common electrode is arranged over the meltable conductive component and electrically coupled to the meltable conductive component.

Abstract: A method for forming a T-shaped gate is provided. The method includes providing a substrate. Then, a photoresist structure is formed over the substrate. The photoresist structure includes two development rates. Next, a mask with an opening is formed over the photoresist structure to pattern the photoresist structure. An angle exposure is applied to the photoresist structure, and the exposed photoresist structure is developed to form a T-shaped notch. A width of the T-shaped notch is gradually reduced from a top portion thereof to a bottom portion to expose a surface of the substrate. Then, a gate metal is deposited in the T-shaped notch. Thereafter, the patterned photoresist structure is removed to form the T-shaped gate.