Abstract: Methods, systems, and devices for timing signal delay compensation in a memory device are described. In some memory devices, operations for accessing memory cells may be performed with timing that is asynchronous relative to an input signal. To support asynchronous timing, a memory device may include delay components that support generating a timing signal having aspects that are delayed relative to an input signal. In accordance with examples as disclosed herein, a memory device may include delay components having a variable and configurable impedance, where the configurable impedance may be based at least in part on a configuration signal generated at the memory device. A configuration signal may be generated based on fabrication characteristics of the memory device, or based on operating conditions of the memory device, or various combinations thereof.

Abstract: Systems, methods, and apparatuses relating to interlocking transistor active regions are disclosed. An apparatus includes a gate including electrically conductive material and an active material including a doped semiconductor material. A portion of the active material overlapped by the gate has an at least substantially triangular shape. An apparatus includes a plurality of active materials. Each active material of includes tapered ends and a plurality of gates. The plurality of active materials is arranged in an interlocking pattern with at least some tapered ends of the active materials interlocking with at least some others of the tapered ends. The plurality of gates overlaps the interlocked tapered ends of the plurality of active materials.

Abstract: A semiconductor device may include a bandgap circuit that outputs a reference voltage. The semiconductor device may also include a startup circuit coupled to the bandgap circuit. The startup circuit may connect a voltage source to a node that corresponds to an output of the bandgap circuit in response to the bandgap circuit being initialized. The startup circuit may also disconnect the voltage source from the node in response to the reference voltage being greater than a threshold.

Abstract: Systems and devices are provided for fully discharging leakage current generated during standby and/or power down modes regardless of variations in PVT conditions. An apparatus may include a power generation unit that powers components of the apparatus and a bleeder circuit. The bleeder circuit may include an operational amplifier. Further, the bleeder circuit may include leakage current generator circuitry that is coupled to the operational amplifier and generates a first current that mimics leakage current generated by the power generation unit. Furthermore, the bleeder circuit may include leakage current mirroring circuitry that is coupled to an output of the operational amplifier and that generates a second current that mirrors the first current. In addition, the bleeder circuit may also include leakage current bleeder circuitry that is coupled to the leakage current mirroring circuitry and that generates a third current that sinks the leakage current to ground.

Abstract: Apparatus and methods are described for voltage dependent delay. An example apparatus includes an oscillator including a delay circuit that is configured to provide an oscillating output signal has a delay based on a delay of the delay circuit. The delay of the delay circuit is based on a voltage it receives. For example, the delay of the delay circuit increases for an increasing received voltage and decreases for a decreasing received voltage. As a result, the oscillating output signal provided by the oscillator is based on the received voltage. For example, a frequency of the oscillating output signal decreases for increasing received voltage and increases for decreasing received voltage. Described in another way, the frequency of the oscillating output signal is relatively low for relatively high received voltage and relatively high for relatively low received voltage.

Abstract: A circuit may include a voltage line and latch circuitry. The latch circuitry may be characterized by a switching voltage threshold and may be coupled to the voltage line. The latch circuitry may generate an output used to determine a state of a fuse. The circuit may also include generation circuitry coupled to the latch circuitry via the voltage line, wherein the generation circuitry is configured to pre-charge the voltage line to a first voltage between a system logical low voltage and the switching voltage threshold.

Abstract: Systems and devices are provided for fully discharging leakage current generated during standby and/or power down modes regardless of variations in PVT conditions. An apparatus may include a power generation unit that powers components of the apparatus and a bleeder circuit. The bleeder circuit may include an operational amplifier. Further, the bleeder circuit may include leakage current generator circuitry that is coupled to the operational amplifier and generates a first current that mimics leakage current generated by the power generation unit. Furthermore, the bleeder circuit may include leakage current mirroring circuitry that is coupled to an output of the operational amplifier and that generates a second current that mirrors the first current. In addition, the bleeder circuit may also include leakage current bleeder circuitry that is coupled to the leakage current mirroring circuitry and that generates a third current that sinks the leakage current to ground.

Abstract: A server with a double-firmware storage space and a firmware update method therefor are provided. The server includes a baseboard management controller (BMC) with a control module and an update module, a selection circuit, a first storage circuit, and a second storage circuit. The control module executes a first firmware program from the first storage circuit. The update module stores a second firmware program in the second storage circuit according to a firmware update instruction when the control module executes the first firmware program. The BMC resets after the second firmware program is stored in the second storage circuit. After the BMC is reset, the control module obtains the second firmware program from the second storage circuit and executes the second firmware program.

Abstract: Apparatuses and methods for providing a current independent of temperature are described. An example apparatus includes a current generator that includes two components that are configured to respond equally and opposite to changes in temperature. The responses of the two components may allow a current provided by the current generator to remain independent of temperature. One of the two components in the current generator may mirror a component included in a voltage source that is configured to provide a voltage to the current generator.

Abstract: A memory device includes a memory array including a plurality of memory cells; and an array timer coupled to the memory array, configured to generate an output timing signal based on a fixed input and a reference signal, wherein: the fixed input is from a supply circuit, the reference signal is from a reference block, and the output timing signal is configured to control the memory array.

Abstract: Systems and devices are provided for generating a process, voltage, temperature (PVT)-independent reference current for a relatively low voltage domain. An apparatus may include a bandgap circuit that outputs a bandgap voltage and a first proportion-to-absolute temperature (PTAT) current. The apparatus may also include trimming circuitry that outputs a reference a voltage based at least in part on the bandgap voltage. Further, the apparatus may include reference current generation circuitry. In particular, the reference current generation circuitry may include a complementary-to-absolute-temperature (CTAT) current generation portion that generates a CTAT current based on the reference voltage as well as a PTAT current tuning portion that tunes a received first PTAT current to generate a second PTAT current.

Abstract: Systems and devices are provided for fully discharging leakage current generated during standby and/or power down modes regardless of variations in PVT conditions. An apparatus may include a power generation unit that powers components of the apparatus and a bleeder circuit. The bleeder circuit may include an operational amplifier. Further, the bleeder circuit may include leakage current generator circuitry that is coupled to the operational amplifier and generates a first current that mimics leakage current generated by the power generation unit. Furthermore, the bleeder circuit may include leakage current mirroring circuitry that is coupled to an output of the operational amplifier and that generates a second current that mirrors the first current. In addition, the bleeder circuit may also include leakage current bleeder circuitry that is coupled to the leakage current mirroring circuitry and that generates a third current that sinks the leakage current to ground.

Abstract: Apparatuses, methods, and current generators that generate current are described. An example apparatus includes a current source configured to provide a current. The current source may be coupled to a voltage source via a transistor. The transistor may be configured to provide the voltage source to the current source based on a voltage of a gate of the transistor. The example apparatus may further include an amplifier configured to provide a voltage to the gate of the transistor based on a voltage differential between two inputs. The voltage differential between the two inputs may adjust due to process, voltage or temperature changes such that the current provided by the current source remains constant.

Abstract: An apparatus is described comprising a bandgap reference circuit comprising: an amplifier including first and second inputs and an output; and a bandgap transistor coupled to the output of the amplifier at a control electrode thereof, the bandgap transistor being further coupled commonly to the first and second inputs of the amplifier at a first electrode thereof to form a feedback path. The apparatus further comprises a resistor coupled to the first electrode of the bandgap transistor.

Abstract: A memory device includes a memory array including a plurality of memory cells; and an array timer coupled to the memory array, configured to generate an output timing signal based on a fixed input and a reference signal, wherein: the fixed input is from a supply circuit, the reference signal is from a reference block, and the output timing signal is configured to control the memory array.

Abstract: Apparatus and methods for a delay circuit are provided. In an example, a delay circuit can include a resistor configured to receive a compensation current, a capacitor configured to receive a charge current based on the compensation current, a first compensation circuit configured to provide a control signal, and a charge-current coupling circuit. The first compensation circuit can include an inverter circuit configured to track an inverter threshold voltage across process, voltage and temperature variations, wherein an output of the inverter circuit is directly coupled to an input of the inverter circuit, and an amplifier configured to receive the output of the inverter circuit an provide the control signal. The charge-current coupling circuit can be configured to receive the control signal and to provide the compensation current and the charge current.

Abstract: A memory device includes a memory array including a plurality of memory cells; and an array timer coupled to the memory array, configured to generate an output timing signal based on a V-I stable input and an analog reference signal, wherein: the V-I stable input is from a bandgap supply circuit, the analog reference signal is from an analog reference block, and the output timing signal is configured to control the memory array.

Abstract: Systems and devices are provided for generating a process, voltage, temperature (PVT)-independent reference current in a resource-efficient manner. A semiconductor device may include a bandgap circuit that outputs a reference voltage and gate signal. The semiconductor device may also include a reference current circuit that includes a complementary-to-absolute-temperature (CTAT) current generation portion and a variation-independent reference current generation portion. The variation-independent reference current generation portion may receive the gate signal from the bandgap circuit, apply the gate signal to a proportion-to-absolute temperature (PTAT) branch of the variation-independent reference current generation portion, and generate mirror PTAT and CTAT currents. The reference current circuit may also include a reference node that generates the reference current supply based at least in part on the mirror CTAT current and the mirror PTAT current.

Abstract: Apparatuses, methods, and current generators that generate current are described. An example apparatus includes a current source configured to provide a current. The current source may be coupled to a voltage source via a transistor. The transistor may be configured to provide the voltage source to the current source based on a voltage of a gate of the transistor. The example apparatus may further include an amplifier configured to provide a voltage to the gate of the transistor based on a voltage differential between two inputs. The voltage differential between the two inputs may adjust due to process, voltage or temperature changes such that the current provided by the current source remains constant.

Abstract: A server with a double-firmware storage space and a firmware update method therefor are provided. The server includes a baseboard management controller (BMC) with a control module and an update module, a selection circuit, a first storage circuit, and a second storage circuit. The control module executes a first firmware program from the first storage circuit. The update module stores a second firmware program in the second storage circuit according to a firmware update instruction when the control module executes the first firmware program. The BMC resets after the second firmware program is stored in the second storage circuit. After the BMC is reset, the control module obtains the second firmware program from the second storage circuit and executes the second firmware program.