Patents by Inventor Lu Cui

Lu Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240426210
    Abstract: A method for determining a recovery factor of a deep coal bed methane (CBM) well includes steps of: (1) collecting an original formation pressure and pressure-volume-temperature (PVT) experimental data of the CBM well, and establishing a relationship table between pressure and deviation factor; (2) obtaining isothermal adsorption experimental data, an original adsorbed gas content and an original free gas content for the deep coal rock; (3) according to the isothermal adsorption experimental data, determining Langmuir's pressure and Langmuir's volume; (4) determining an abandoned formation pressure in CBM well exploitation; (5) obtaining a deviation factor at the original formation pressure and a deviation factor at the abandoned formation pressure; and (6) according to the original formation pressure, the original adsorbed gas content, the original free gas content, the Langmuir's pressure, the abandoned formation pressure, the above deviation factors, the recovery factor of the CBM well is calculated.
    Type: Application
    Filed: September 3, 2024
    Publication date: December 26, 2024
    Inventors: Bo Hu, Yongyi Zhou, Kui Chen, Linsong Liu, Yaonan Yu, Yanling Luo, Lu Cui
  • Publication number: 20240318541
    Abstract: The present invention relates to development research of oil and gas fields, and more particularly to a method for determining transmissibilty in numerical simulation of oil and gas reservoirs on unstructured grids. Based on the core seepage experimental data and well logging data of the drilled wells, the method takes into account the centroid distance of two adjacent grids as well as seepage direction vectors in the oil and gas reservoir simulation, and then adopts effective seepage area and directional permeability of the interface between the adjacent grids in seepage direction to calculate the transmissibilty. The present invention further verifies the reliability of the method by a rectangular grid example (rectangular grid is a special case of unstructured grids) whose accurate transmissibilty values can be obtained. The method of the present invention is simple, easy to understand and realize, operable, effective and practical.
    Type: Application
    Filed: May 30, 2024
    Publication date: September 26, 2024
    Inventors: Yongyi Zhou, Bo Hu, Kui Chen, Yongming He, Jiawei Zhang, Yaonan Yu, Shenqi Peng, Yuanxiang Sun, Lu Cui
  • Publication number: 20240110183
    Abstract: Methods are provided for the treatment of cancer and/or fibrosis. It is shown that there is increased CD63 expression both in lung cancer and pulmonary fibrosis, sarcoma, skin fibrosis, liver cancer and liver cirrhosis, NASH and NHFLD, and kidney fibrosis from hypertension and other etiologies. Inhibiting CD63 increases phagocytosis of lung cancer cells and lung fibroblasts; and can eliminates tumor cells and pathogenic fibrosis.
    Type: Application
    Filed: December 21, 2021
    Publication date: April 4, 2024
    Inventors: Gerlinde Wernig, Tristan Lerbs, Lu Cui, Qiwen Deng, Cristabelle De Souza
  • Publication number: 20090035895
    Abstract: A chip package comprises a substrate, a chip, a conductive layer and a molding compound. The substrate has a carrying surface and at least a ground pad disposed on the carrying surface. The chip has an active surface and a back surface opposite thereto. The chip is bonded to the substrate with the active surface facing towards the carrying surface of the substrate, wherein the ground pad is disposed outside of the chip. The conductive layer covers the chip and a portion of the carrying surface, and electrically connects to the ground pad. The molding compound is disposed on the carrying surface of the substrate and encapsulates the chip and the conductive layer.
    Type: Application
    Filed: July 30, 2007
    Publication date: February 5, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Min-Ik Lee, Ming-Lu Cui, Hong-Hyoun Kim