Patents by Inventor Lu Fei Zhang

Lu Fei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device package
    Patent number: 10475973
    Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: November 12, 2019
    Assignee: LUMILEDS LLC
    Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20170288109
    Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.
    Type: Application
    Filed: June 5, 2017
    Publication date: October 5, 2017
    Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
  • Light emitting device package
    Patent number: 9691959
    Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: June 27, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20160315237
    Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.
    Type: Application
    Filed: January 7, 2015
    Publication date: October 27, 2016
    Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker