Patents by Inventor Lu-Hsun LIN

Lu-Hsun LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079227
    Abstract: A wafer retaining device is provided. The wafer retaining device includes a platen configured to support a semiconductor wafer, and a retainer assembly. The retainer assembly includes a mounting member coupled to the platen, a lever, and a biasing member including a first end coupled to the lever and a second end coupled to the mounting member. The biasing member is configured to bias the lever to a closed position relative to the platen. The lever inhibits movement of the semiconductor wafer when the lever is in the closed position.
    Type: Application
    Filed: January 18, 2024
    Publication date: March 6, 2025
    Inventors: Lu-Hsun LIN, Tsung-Min LIN, Chin Tsung LIN, Hsiao-Yin HSIEH, Po-Tang TSENG
  • Patent number: 12243707
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Heng Yen, Jen-Chung Chiu, Tai-Kun Kao, Lu-Hsun Lin, Tsung-Min Lin
  • Publication number: 20230386778
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN
  • Patent number: 11830700
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: November 28, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Heng Yen, Jen-Chung Chiu, Tai-Kun Kao, Lu-Hsun Lin, Tsung-Min Lin
  • Publication number: 20220199351
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 23, 2022
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN
  • Patent number: 11295926
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Heng Yen, Jen-Chung Chiu, Tai-Kun Kao, Lu-Hsun Lin, Tsung-Min Lin
  • Publication number: 20200211809
    Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
    Type: Application
    Filed: November 27, 2019
    Publication date: July 2, 2020
    Inventors: Ching-Heng YEN, Jen-Chung CHIU, Tai-Kun KAO, Lu-Hsun LIN, Tsung-Min LIN