Abstract: The present invention provides a conjugate and preparation method thereof, a pharmaceutical composition comprising the conjugate and use of the pharmaceutical composition in the manufacture of a medicament for the treatment or prevention of a disease.

Abstract: A display device is provided, including: a back plate; a plastic frame connected to the back plate; a backlight module; a privacy film on a light emitting side of the backlight module; and a dimming sheet on a side of privacy film away from the back plate, wherein the dimming sheet is configured to be capable of adjusting a viewing angle of the display device. The plastic frame includes a first surface and a side end face, the first surface is a surface of the plastic frame close to the dimming sheet, the side end face is a side face of the plastic frame close to the dimming sheet, the plastic frame further includes a chamfered portion at a transition position between the side end face and the first surface, and the chamfered portion has a rough surface that is configured for diffracting the light incident on the chamfered portion.

Abstract: The application discloses an array substrate and a mother-board for array substrates. The array substrate includes a display area and a non-display area on a periphery of the display area. The non-display area is provided with an interface area. The array substrate includes: multiple signal lines extending in the display area and leading to the non-display area; multiple pads located in the interface Area, and each of the multiple pads is connected to a corresponding one of the multiple signal lines; and a short-circuiting component located in the non-display area, wherein the short-circuiting component is connected with the multiple pads, the multiple signal lines connected with the pads are short-circuited, and the short-circuiting component includes a patterned first metal structure. The array substrate according to embodiments of the present application can avoid problems caused by static electricity, such as, electrostatic damage or product defects.

Abstract: A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: A conjugate and preparation method therefor, comprising a medication composition comprising the conjugate and a use of the medication composition in preparing medications for the treatment or prevention of diseases.

Abstract: The present invention provides a conjugate and preparation method thereof, a pharmaceutical composition comprising the conjugate and use of the pharmaceutical composition in the manufacture of a medicament for the treatment or prevention of a disease.

Abstract: A transformer and a power supply device. In the transformer, the first secondary coil including: first and second plate coils; and a first holding portion formed therebetween, the second secondary coil including: third and fourth plate coils; and a second holding portion formed therebetween, the first secondary coil is arranged between the third and fourth coils, the ends of the first plate coil and third plate coil are connected by solder, and the ends of the second plate coil and fourth plate coil are connected by solder, when the secondary-side rectifier circuit is a center-tapped rectifier circuit, the first holding portion, the second holding portion, and the bus bar are connected by solder through the connection hole, when the secondary-side rectifier circuit is a rectifier circuit other than the center-tapped rectifier circuit, the first holding portion and the second holding portion are connected by solder through the connection hole.

Abstract: A coil component includes: first and second magnetic cores having first and second flat plate portions; a winding having a hollow core portion; first and second heat dissipation metal plates having first and second heat dissipation plane and first and second heat conduction portions, at least either one of the first and second flat plate portions has a middle leg, the middle leg is inserted into the hollow core portion of a winding, and the first magnetic core and the second magnetic core are combined in such a way that the first flat plate portion and the second flat plate portion face each other, the first heat dissipation plane portion is closely attached to the first flat plate portion and the second heat dissipation plane portion is closely attached to the second flat plate portion, the first heat conduction portion is connected to the second heat conduction portion.

Abstract: A drive circuit driving a first switching element, including: a first diode with a cathode terminal connected to a first switching element gate terminal; a second switching element with a first terminal connected to a first diode anode terminal, a second terminal connected to a first switching element gate terminal, a third terminal connected to a first switching element source terminal; a third switching element with a drain terminal connected to the first diode anode terminal, and a source terminal connected to the first switching element source terminal; a parallel circuit; and a drive transformer having a coil, one end connected to the drain terminal, the other end connected to the third switching element gate terminal, and connected to the third switching element source terminal, one end of the parallel circuit connected to one coil end, the second diode cathode terminal connected to the other end of the coil.

Abstract: A transformer and a power supply device. In the transformer, the first secondary coil including: first and second plate coils; and a first holding portion formed therebetween, the second secondary coil including: third and fourth plate coils; and a second holding portion formed therebetween, the first secondary coil is arranged between the third and fourth coils, the ends of the first plate coil and third plate coil are connected by solder, and the ends of the second plate coil and fourth plate coil are connected by solder, when the secondary-side rectifier circuit is a center-tapped rectifier circuit, the first holding portion, the second holding portion, and the bus bar are connected by solder through the connection hole, when the secondary-side rectifier circuit is a rectifier circuit other than the center-tapped rectifier circuit, the first holding portion and the second holding portion are connected by solder through the connection hole.

Abstract: A drive circuit driving a first switching element, including: a first diode with a cathode terminal connected to a first switching element gate terminal; a second switching element with a first terminal connected to a first diode anode terminal, a second terminal connected to a first switching element gate terminal, a third terminal connected to a first switching element source terminal; a third switching element with a drain terminal connected to the first diode anode terminal, and a source terminal connected to the first switching element source terminal; a parallel circuit; and a drive transformer having a coil, one end connected to the drain terminal, the other end connected to the third switching element gate terminal, and connected to the third switching element source terminal, one end of the parallel circuit connected to one coil end, the second diode cathode terminal connected to the other end of the coil.

Abstract: A coil component includes: first and second magnetic cores having first and second flat plate portions; a winding having a hollow core portion; first and second heat dissipation metal plates having first and second heat dissipation plane and first and second heat conduction portions, at least either one of the first and second flat plate portions has a middle leg, the middle leg is inserted into the hollow core portion of a winding, and the first magnetic core and the second magnetic core are combined in such a way that the first flat plate portion and the second flat plate portion face each other, the first heat dissipation plane portion is closely attached to the first flat plate portion and the second heat dissipation plane portion is closely attached to the second flat plate portion, the first heat conduction portion is connected to the second heat conduction portion.

Abstract: In a method for calculating vehicle insurance fee, core data transmitted from an electronic device in a vehicle is received. The core date includes information as to how the vehicle is driven, by recording the driving style of the driver e, purchase price of the vehicle, and other basic information. A driving risk level of the vehicle is determined according to the received core data. A comprehensive risk coefficient associated with the driving risk level is obtained. An insurance fee of the vehicle is calculated based on the comprehensive risk coefficient and a preset sheet of parameters.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging plasmids and packagable vector transcripts are produced from high expression plasmids after stable or transient transfection in mammalian cells. High titers of recombinant retrovirus are produced in these transfected mammalian cells and can then transduce a mammalian target cell by cocultivation or supernatant infection. The methods of the invention include the use of the novel retroviral packaging plasmids and vectors to transduce primary human cells, including T cells and human hematopoietic stem cells, with foreign genes by cocultivation or supernatant infection at high efficiencies. The invention is useful for the rapid production of high titer viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging plasmids and packagable vector transcripts are produced from high expression plasmids after stable or transient transfection in mammalian cells. High titers of recombinant retrovirus are produced in these transfected mammalian cells and can then transduce a mammalian target cell by cocultivation or supernatant infection. The methods of the invention include the use of the novel retroviral packaging plasmids and vectors to transduce primary human cells, including T cells and human hematopoietic stem cells, with foreign genes by cocultivation or supernatant infection at high efficiencies. The invention is useful for the rapid production of high titer viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging plasmids and packagable vector transcripts are produced from high expression plasmids after stable or transient transfection in mammalian cells. High titers of recombinant retrovirus are produced in these transfected mammalian cells and can then transduce a mammalian target cell by cocultivation or supernatant infection. The methods of the invention include the use of the novel retroviral packaging plasmids and vectors to transduce primary human cells, including T cells and human hematopoietic stem cells, with foreign genes by cocultivation or supernatant infection at high efficiencies. The invention is useful for the rapid production of high titer viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging constructs and packagable vector transcripts are produced from high expression plasmids by transfection in human cells. High titers of recombinant retrovirus are produced in infected cells. The methods of the invention include the use of the novel retroviral constructs to transduce primary human cells, including T cells and human hematopoietic stem cells, with foreign genes by cocultivation at high efficiencies. The invention is useful for the rapid production of high viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging constructs and packagable vector transcripts are produced from high expression plasmids by transfection in human cells. High titers of recombinant retrovirus are produced in infected cells. The methods of the invention include the use of the novel retroviral constructs to transduce primary human cells, including T cells and bone marrow stem cells, with foreign genes by cocultivation at high efficiencies. The invention is useful for the rapid production of high viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.

Abstract: The invention provides a novel retroviral packaging system, in which retroviral packaging constructs and packagable vector transcripts are produced from high expression plasmids by transfection in human cells. High titers of recombinant retrovirus are produced in infected cells. The methods of the invention include the use of the novel retroviral constructs to transduce primary human cells, including T cells and human hematopoietic stem cells, with foreign genes by cocultivation at high efficiencies. The invention is useful for the rapid production of high viral supernatants, and to transduce with high efficiency cells that are refractory to transduction by conventional means.