Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.

Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.

Abstract: The present disclosure relates to a graphite oxide-containing resin formulation, including: 15-80 parts by weight of a polyamideimide precursor, 0.01-10 parts by weight of a graphite oxide as a dispersant, 10-400 parts by weight of an inorganic powder, and 20-350 parts by weight of a solvent.

Abstract: The present disclosure provides a low dielectric constant resin formulation comprising 20-150 parts by weight of diisocyanate, 20-400 parts by weight of poly(2,6-dialkyl-1,4-phenylene oxide), and 200-650 parts by weight of a solvent. The present disclosure also provides a low dielectric constant resin prepolymer, composition, and composite produced from the above formulation, and a method for preparing the low dielectric constant resin prepolymer solution.

Abstract: A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation.

Abstract: The present disclosure provides a low dielectric constant resin formulation comprising 20-150 parts by weight of diisocyanate, 20-400 parts by weight of poly(2,6-dialkyl-1,4-phenylene oxide), and 200-650 parts by weight of a solvent. The present disclosure also provides a low dielectric constant resin prepolymer, composition, and composite produced from the above formulation, and a method for preparing the low dielectric constant resin prepolymer solution.

Abstract: The present disclosure is related to a carbon-nanomaterial-supported catalyst, including: a carbon nanomaterial, and a polymer grafted onto the carbon nanomaterial, wherein the polymer has a repeat unit containing a phosphonium salt and its molecular weight is 1,000-200,000. The disclosure is also related to a method of preparing carbonate, which includes using the carbon nanomaterial-supported catalyst for the cycloaddition reaction of carbon dioxide into the epoxy group.

Abstract: A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation.

Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.

Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.

Abstract: A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.

Abstract: A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7˜10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40˜65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.