Patents by Inventor Lu Xiao
Lu Xiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12101045Abstract: A system is described in which a magnetic mover includes at least one mover identification device. The system also includes a stator defining a work surface and including an actuation coil assembly and at least one stator identification device operable to interact with the at least one mover identification device. One or more sensors are used to sense a position of the first magnetic mover. One or more stator driving circuits are used to drive the actuation coil assembly to thereby move the first magnetic mover over the work surface. The first magnetic mover includes one or more magnetic components positioned such that interaction of one or more magnetic fields emitted by the one or more magnetic components with one or more magnetic fields generated by the actuation coil assembly when driven by the one or more stator driving circuits enables movement of the first magnetic mover in at least two degrees of freedom.Type: GrantFiled: December 23, 2022Date of Patent: September 24, 2024Assignee: Planar Motor IncorporatedInventors: Xiaodong Lu, Yao Kevin Xiao
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Patent number: 12099739Abstract: Embodiments of the present disclosure relate to a method, system and computer program product for trace data protection. In some embodiments, a method is disclosed. According to the method, a target task is determined from a plurality of tasks, where trace data of the target task is to be protected. The trace data of the target task is transferred from a first area to a second area of a memory. Existing trace data in the second area is offloaded to a storage device before being overwritten. In other embodiments, a system and a computer program product are disclosed.Type: GrantFiled: July 28, 2020Date of Patent: September 24, 2024Assignee: International Business Machines CorporationInventors: Xi Bo Zhu, Xiao Xiao Pei, Shi Yu Wang, Qin Li, Lu Zhao
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Publication number: 20240307496Abstract: The present invention relates to the field of biomedicine. Disclosed herein is a method for preventing cancer recurrence, comprising i) intermittently administering an interferon-based therapeutic agent, and optionally ii) administering an additional anticancer agent, to a subject. The present invention also relates to a pharmaceutical combination for use in said method.Type: ApplicationFiled: January 20, 2022Publication date: September 19, 2024Applicants: XIAMEN AMOYTOP BIOTECH CO., LTD., BIOSTEED GENE TRANSFORMATION TECH. CO., LTD.Inventors: Xiaojin LIAO, Hanzhou WU, Hongran CHU, Peijuan ZHU, Tingting ZHANG, Qingjiang XIAO, Fenghong YIN, Linying WU, Lu ZHUANG, Weidong ZHOU, Li SUN
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Publication number: 20240304693Abstract: Aspects of the disclosure provide a method for fabricating a semiconductor device having an first stack of alternating insulating layers and sacrificial word line layers arranged over a substrate, the first stack including a core region and a staircase region. The method can include forming a first dielectric trench in the core region of the first stack, forming a second dielectric trench that is adjacent to and connected with the first dielectric trench in the staircase region of the first stack, and forming dummy channel structures extending through the first stack where the dummy channel structures are spaced apart from the second dielectric trench.Type: ApplicationFiled: May 17, 2024Publication date: September 12, 2024Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Hang YIN, Zhipeng WU, Kai HAN, Lu ZHANG, Pan WANG, Xiangning WANG, Hui ZHANG, Jingjing GENG, Meng XIAO
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Publication number: 20240296004Abstract: A display apparatus and a splice display system are disclosed. The display apparatus includes: a lamp panel, which includes a circuit board and a plurality of light-emitting elements on the circuit board; and a mask on side of the plurality of light-emitting elements away from the circuit board, where the mask includes a plurality of light-transmitting parts corresponding to the plurality of light-emitting elements, an orthographic projection of each of the plurality of light-emitting elements on the circuit board is within an orthographic projection of a corresponding light-transmitting part on the circuit board, each of the plurality of light-transmitting parts includes a concave lens, and a surface of the concave lens close to the light-emitting element is a concave arc surface.Type: ApplicationFiled: March 8, 2022Publication date: September 5, 2024Inventors: Chao YU, Jian WU, Quanzhong WANG, Junmin SUN, Lu XIAO
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Patent number: 12068233Abstract: Provided are an adapter board and a method for forming the same, a packaging method, and a package structure. One form of a method for forming an adapter board includes: providing a base, including an interconnect region and a capacitor region, the base including a front surface and a rear surface that are opposite each other; etching the front surface of the base, to form a first trench in the base of the interconnect region and form a second trench in the base of the capacitor region; forming a capacitor in the second trench; etching a partial thickness of the base under the first trench, to form a conductive via; forming a via interconnect structure in the conductive via; and thinning the rear surface of the base, to expose the via interconnect structure.Type: GrantFiled: March 21, 2023Date of Patent: August 20, 2024Assignee: Semiconductor Manufacturing North China (Beijing) CorporationInventors: Cai Qiaoming, Yang Lie Yong, Chen Wei, Lu Xiao Yu
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Publication number: 20240246916Abstract: A 7-nitro-8-hydroxyquinoline derivative, a preparation method therefor and the medical use thereof. Specifically, disclosed are a compound as shown in general formula (I), a preparation method therefor, a pharmaceutical composition containing same, and the use thereof in the treatment of infectious diseases or cancers. The compound has excellent antibacterial and antitumor activities and can be developed into a drug for treating infectious diseases or tumors.Type: ApplicationFiled: May 30, 2022Publication date: July 25, 2024Inventors: Yijun DENG, Liang WU, Lu XIAO
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Publication number: 20230328007Abstract: The present disclosure provides an interface data processing method, a transmitting-end device and a receiving-end device. The method includes: mapping data to be processed into interface data based on a data type of the data to be processed, a data type which a receiving-end device can process and preset block description information; and sending the interface data to the receiving-end device.Type: ApplicationFiled: August 16, 2021Publication date: October 12, 2023Inventor: Lu XIAO
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Publication number: 20230295094Abstract: The present invention discloses a nitroxoline derivative, a preparation method therefor, and use thereof. Specifically, the present discloses a compound as represented by general formula (I), a preparation method therefor, a pharmaceutical composition containing same, and use thereof in treating infectious diseases or cancers. The compound of the present invention has excellent anti-tumor activity and antibacterial activity, and can be developed into a drug for treating tumors and infectious diseases. The definition of each group in general formula (I) is the same as that in the description.Type: ApplicationFiled: July 30, 2021Publication date: September 21, 2023Inventors: Liang WU, Yijun DENG, Lu XIAO, Ke PAN
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Publication number: 20230223329Abstract: Provided are an adapter board and a method for forming the same, a packaging method, and a package structure. One form of a method for forming an adapter board includes: providing a base, including an interconnect region and a capacitor region, the base including a front surface and a rear surface that are opposite each other; etching the front surface of the base, to form a first trench in the base of the interconnect region and form a second trench in the base of the capacitor region; forming a capacitor in the second trench; etching a partial thickness of the base under the first trench, to form a conductive via; forming a via interconnect structure in the conductive via; and thinning the rear surface of the base, to expose the via interconnect structure.Type: ApplicationFiled: March 21, 2023Publication date: July 13, 2023Applicant: Semiconductor Manufacturing North China (Beijing) CorporationInventors: Cai Qiaoming, Yang Lie Yong, Chen Wei, Lu Xiao Yu
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Patent number: 11637059Abstract: Provided are an adapter board and a method for forming the same, a packaging method, and a package structure. One form of a method for forming an adapter board includes: providing a base, including an interconnect region and a capacitor region, the base including a front surface and a rear surface that are opposite each other; etching the front surface of the base, to form a first trench in the base of the interconnect region and form a second trench in the base of the capacitor region; forming a capacitor in the second trench; etching a partial thickness of the base under the first trench, to form a conductive via; forming a via interconnect structure in the conductive via; and thinning the rear surface of the base, to expose the via interconnect structure.Type: GrantFiled: January 22, 2021Date of Patent: April 25, 2023Assignee: SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATIONInventors: Cai Qiaoming, Yang Lie Yong, Chen Wei, Lu Xiao Yu
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Publication number: 20230006003Abstract: A display panel, a display device, and an evaporation device are provided. The display panel includes a plurality of pixel units arranged in an array. Each pixel unit includes four first sub-pixels, two second sub-pixels, and two third sub-pixels. Centers of the two second sub-pixels and centers of the two third sub-pixels form a virtual isosceles trapezoid. The two second sub-pixels are located on both ends of a diagonal of the virtual isosceles trapezoid, and the two third sub-pixels are located on both ends of another diagonal of the virtual isosceles trapezoid. Centers of the four first sub-pixels form a virtual quadrilateral. An interior of the virtual quadrilateral includes one second sub-pixel of the two second sub-pixels, and an interior of the virtual isosceles trapezoid includes one first sub-pixel of the four first sub-pixels.Type: ApplicationFiled: April 15, 2022Publication date: January 5, 2023Inventors: Wei HUANG, Lu XIAO, Qin YUE, Yangzhao MA, Zhongjie ZHANG
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Patent number: 11532260Abstract: Disclosed are display panel and display device. The display panel includes plurality of pixel repetitive units arranged in array. Each pixel repetitive unit includes two first sub-pixels, two second sub-pixels and four third sub-pixels, and light emitting colors of two first sub-pixels, two second sub-pixels and four third sub-pixels are different. For each pixel repetitive unit, centers of four third sub-pixels constitute first virtual square, one first sub-pixel located inside the first virtual square, and center of the first virtual square doesn't overlap center of one first sub-pixel located inside the first virtual square; and centers of two first sub-pixels and centers of two second sub-pixels constitute first virtual parallelogram, and one third sub-pixel located inside the first virtual parallelogram. The arrangement of the third sub-pixels can reduce display serrated sense of vertical line array and improve display effect of vertical line, thereby improving display effect of display panel.Type: GrantFiled: August 12, 2021Date of Patent: December 20, 2022Assignee: WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.Inventors: Wei Huang, Lu Xiao, Qin Yue, Yangzhao Ma, Zhongjie Zhang
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Patent number: 11500689Abstract: A communication method includes monitoring, by a shared agent, shared memory, wherein the shared memory is used by a first application, wherein the first application runs on a virtual device, wherein the virtual device is located on a host, wherein the shared memory belongs to a part of memory of the host and does not belong to memory specified by the host for the virtual device, and wherein the shared agent is disposed on the host independent of the virtual device, determining, by the shared agent, whether data of the first application is written to the shared memory, reading, by the shared agent, the data from the shared memory and sending the data to a second application in response to the data of the first application is written to the shared memory, wherein the second application is a data sharing party specified by the first application.Type: GrantFiled: August 21, 2020Date of Patent: November 15, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Lu Xiao, Mingchang Wei
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Publication number: 20220346217Abstract: A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.Type: ApplicationFiled: August 11, 2020Publication date: October 27, 2022Applicant: SHENGYI ELECTRONICS CO., LTD.Inventors: Lu XIAO, Hongyu WU, Chengguang JI, Mengru LIU, Zhengqing CHEN, Hongbing DU, Haibo TANG
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Patent number: 11422800Abstract: Groups of architecturally connected files may incur and accumulate high maintenance costs as architectural debts. To quantify such debts, architectural debt, which is a term used herein, may be identified, quantified, measured, and modeled. A history coupling probability matrix for this purpose may search for architecture debts through the lens of 4 patterns of prototypical architectural flaws shown to correlate with reduced software quality. Further, a new architecture maintainability metric—Decoupling Level (DL)—measures how well the software can be decoupled into small and independently replaceable modules. The DL metric opens the possibility of quantitatively comparing maintainability between different projects, as well as monitoring architecture decay throughout software evolution.Type: GrantFiled: December 19, 2016Date of Patent: August 23, 2022Assignee: Drexel UniversityInventors: Yuanfang Cai, Lu Xiao, Frederick Kazman, Ran Mo
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Publication number: 20220102438Abstract: Disclosed are a display panel and a display device. The display panel includes pixel repetitive units arranged in an array. Each pixel repetitive unit includes two first sub-pixels, two second sub-pixels and four third sub-pixels. In the display panel, a first sub-pixel is located among the four third sub-pixels, a second sub-pixel is located among the four third sub-pixels, and a third sub-pixel is simultaneously located between the two first sub-pixels and between the two second sub-pixels. Centers of the four third sub-pixels surrounding the first sub-pixel constitute a first irregular quadrangle, where lengths of each pair of opposite edges of the first irregular quadrangle 21 are not equal. Embodiments of the present disclosure may improve the display effect of the display panel.Type: ApplicationFiled: December 13, 2021Publication date: March 31, 2022Applicant: WUHAN TIANMA MICROELECTRONICS CO., LTD.Inventors: Lu XIAO, Yangzhao MA, Minhong KIM, Zhiqiang XIA
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Publication number: 20220069031Abstract: Provided are a display panel, a preparation method, and a display device. The display panel includes a plurality of first sub-pixels, a plurality of second sub-pixels, and a plurality of third sub-pixels. The plurality of third sub-pixels forms a first virtual trapezoid, and one of the plurality of first sub-pixels is located inside the first virtual trapezoid. The plurality of first sub-pixels and the plurality of second sub-pixels form a second virtual trapezoid, and one of the plurality of third sub-pixels is located inside the second virtual trapezoid. The first virtual trapezoid includes a first long side, a first oblique side, a first short side, and a second oblique side. The second virtual trapezoid includes a second long side, a third oblique side, a second short side, and a fourth oblique side.Type: ApplicationFiled: November 9, 2021Publication date: March 3, 2022Applicant: Wuhan Tianma Micro-Electronics Co., Ltd.Inventors: Qin YUE, Wei HUANG, Lu XIAO, Yangzhao MA, Zhongjie ZHANG
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Publication number: 20220026433Abstract: Provided herein are methods for multiplexed in situ analysis of biomolecules in a tissue. In particular, provided herein are methods for multiplexed single-cell in situ protein and nucleic acid profiling in fixed or fresh tissues, and also allows the investigation of the different cell compositions and their spatial organizations in intact tissues through consecutive cycles of probe hybridization, fluorescence imaging, and signal removal.Type: ApplicationFiled: November 11, 2019Publication date: January 27, 2022Inventors: Jia GUO, Manas MONDAL, Renjie LIAO, Lu XIAO
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Publication number: 20210398892Abstract: Provided are an adapter board and a method for forming the same, a packaging method, and a package structure. One form of a method for forming an adapter board includes: providing a base, including an interconnect region and a capacitor region, the base including a front surface and a rear surface that are opposite each other; etching the front surface of the base, to form a first trench in the base of the interconnect region and form a second trench in the base of the capacitor region; forming a capacitor in the second trench; etching a partial thickness of the base under the first trench, to form a conductive via; forming a via interconnect structure in the conductive via; and thinning the rear surface of the base, to expose the via interconnect structure.Type: ApplicationFiled: January 22, 2021Publication date: December 23, 2021Applicant: Semiconductor Manufacturing North China (Beijing) CorporationInventors: Cai Qiaoming, Yang Lie Yong, Chen Wei, Lu Xiao Yu