Abstract: A cooling device for a system for cooling electronic components partially immersed in a dielectric fluid, including a first heat exchanger. The first heat exchanger is configured to be partially immersed in the dielectric fluid and includes a first circuit for a first heat-transfer fluid. The cooling device also includes a second heat exchanger configured to be in contact with a part of the electronic components, the second heat exchanger being fluidically connected to the first heat exchanger in such a way that the first heat exchanger and the second heat exchanger together form a second circuit for a second heat-transfer fluid.

Abstract: A heat exchanger including a cooling plate configured to be in contact with electronic components and includes a circulation channel for a first heat-transfer fluid, and includes a two-fluid exchanger with a first fluid circuit in fluidic communication with the circulation channel of the cooling plate to form a circulation loop for the first heat-transfer fluid, and a second fluid circuit configured to receive a second heat-transfer fluid. The heat exchanger can also include an additional cooling plate arranged in contact with the two-fluid exchanger, and at least one heat-transfer element arranged between the additional cooling plate and a second part of the electronic components.