Abstract: A pan inverting system (10) comprises a rotating table (11) having a central longitudinal axis (13), the table being rotatably mounted within a static frame (15) for rotation about the longitudinal axis (13). Conveyors (21) are disposed on opposed pan-receiving surfaces (20) of the table (11). The conveyors (21) are independently operable to displace a pan (12) along the table (11) in a direction substantially parallel to the longitudinal axis (13). A pan engagement device (24) within the table (11) is operable to releasably fasten the pan (12) to the pan receiving surface (20) of the table (11), such that when the pan (12) is fastened to one of the pan receiving surfaces (20) by the pan engagement mechanism (24), rotation of the table (11) about the longitudinally extending axis (13) will invert the pan (12).

Abstract: A pan inverting system (10) comprises a rotating table (11) having a central longitudinal axis (13), the table being rotatably mounted within a static frame (15) for rotation about the longitudinal axis (13). Conveyors (21) are disposed on opposed pan-receiving surfaces (20) of the table (11). The conveyors (21) are independently operable to displace a pan (12) along the table (11) in a direction substantially parallel to the longitudinal axis (13). A pan engagement device (24) within the table (11) is operable to releasably fasten the pan (12) to the pan receiving surface (20) of the table (11), such that when the pan (12) is fastened to one of the pan receiving surfaces (20) by the pan engagement mechanism (24), rotation of the table (11) about the longitudinally extending axis (13) will invert the pan (12).

Abstract: A method of manufacturing a semiconductor device which includes an interface between a metal layer and a barrier layer of a nitride of a refractory metal, comprising the steps of depositing the barrier layer onto a wafer at high temperature; subjecting the barrier layer to a mixture of oxygen or an oxygen-containing gas and an inert gas in the presence of a plasma at low pressure and for a time sufficient to oxidize the surface of the barrier layer; removing the oxygen-containing gas; and depositing the metal layer onto the oxidized surface without subjecting said wafer to an air break. The method permits high throughput to be achieved at low cost.

Abstract: An apparatus for processing a substrate includes at least one closed chamber for containing the substrate in a controlled environment, and a non-evaporable gettering material in the chamber acting as an internal pump serving as the primary pumping means for removing contaminants from the controlled environment. In this way the use of expensive and bulky cryogenic pumps can be avoided or minimized.

Abstract: A ball striking cue comprises a butt section, a shaft section, and a self-locking joint for removably interconnecting the butt and shaft sections end to end. The joint includes the proximate end of the shaft section formed with a conical hole, and the proximate end of the butt section formed with a conical extension. These hole and extension constitute the unique point of contact between the butt and shaft sections. They have complementary shapes and the hole has smaller radial dimensions than the extension whereby the extension can be forced in the hole to press fit the extension in the hole and thereby removably interconnect the butt and shaft sections with a spacing between the bottom of the hole and the free end of the extension. The conical hole and extension widens out and tapers, respectively, at an angle which is function of the nature of their material to enable press fit and retention of the extension in the hole while enabling separation thereof by forcing them axially apart from each other.