Patents by Inventor Luc Guy Frechette

Luc Guy Frechette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal energy harvesting device
    Patent number: 10020758
    Abstract: A first closed enclosure defines a cavity having an inner dimension smaller than 5 mm. At least one second resiliently deformable closed enclosure is connected in fluid communication with the first enclosure. A fluid at more than 90% in the liquid state fills the first and second enclosures. A first portion of the first enclosure is in contact with a hot source of a temperature higher than the evaporation temperature of the fluid. A second portion of the first enclosure located between the first portion and the resiliently deformable closed enclosure is in contact with a cold source at a temperature lower than the condensation temperature of the fluid. An electromechanical transducer is coupled to a deformable membrane of the resiliently deformable closed enclosure.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: July 10, 2018
    Assignees: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Gholamreza Mirshekari, Etienne Leveille, Luc Guy Frechette, Stephane Monfray, Thomas Skotnicki
  • Assembly of an integrated circuit chip and of a plate
    Patent number: 9941188
    Abstract: An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 10, 2018
    Assignees: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Louis-Michel Collin, Luc Guy Frechette, Sandrine Lhostis
  • ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
    Publication number: 20170133297
    Abstract: An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
    Type: Application
    Filed: January 24, 2017
    Publication date: May 11, 2017
    Applicants: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Louis-Michel Collin, Luc Guy Frechette, Sandrine Lhostis
  • Assembly of an integrated circuit chip and of a plate
    Patent number: 9589874
    Abstract: An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: March 7, 2017
    Assignees: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Louis-Michel Collin, Luc Guy Frechette, Sandrine Lhostis
  • THERMAL ENERGY HARVESTING DEVICE
    Publication number: 20160241168
    Abstract: A first closed enclosure defines a cavity having an inner dimension smaller than 5 mm. At least one second resiliently deformable closed enclosure is connected in fluid communication with the first enclosure. A fluid at more than 90% in the liquid state fills the first and second enclosures. A first portion of the first enclosure is in contact with a hot source of a temperature higher than the evaporation temperature of the fluid. A second portion of the first enclosure located between the first portion and the resiliently deformable closed enclosure is in contact with a cold source at a temperature lower than the condensation temperature of the fluid. An electromechanical transducer is coupled to a deformable membrane of the resiliently deformable closed enclosure.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 18, 2016
    Applicants: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Gholamreza Mirshekari, Etienne Leveille, Luc Guy Frechette, Stephane Monfray, Thomas Skotnicki
  • ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
    Publication number: 20160172278
    Abstract: An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.
    Type: Application
    Filed: September 17, 2015
    Publication date: June 16, 2016
    Applicants: STMicroelectronics (Crolles 2) SAS, SOCPRA Sciences et Génie S.E.C.
    Inventors: Louis-Michel Collin, Luc Guy Frechette, Sandrine Lhostis