Patents by Inventor Luc L. Belanger

Luc L. Belanger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of UBM and solder bumps and methods of fabrication
    Patent number: 8003512
    Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.
    Type: Grant
    Filed: February 3, 2009
    Date of Patent: August 23, 2011
    Assignee: International Business Machines Corporation
    Inventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih
  • NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
    Publication number: 20100193949
    Abstract: Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.
    Type: Application
    Filed: February 3, 2009
    Publication date: August 5, 2010
    Applicant: International Business Machines Corporation
    Inventors: Luc L. Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie A. Oberson, Da-Yuan Shih