Abstract: The present invention is directed to a method for detecting anomalies in a semiconductor substrate comprising the steps of providing a semiconductor substrate, making an inspection image I of the substrate, generating an image K from image I by image processing, generating image B by binarizing image K, and examining image I using image B, characterized in that generating image K comprises multiplying a high-pass convolution filtered image G(I) from image I and a first weight image W1. The present invention is also directed to an apparatus suitable for applying the method.

Abstract: The present invention is directed to a method for detecting anomalies in a semiconductor substrate comprising the steps of providing a semiconductor substrate, making an inspection image I of the substrate, generating an image K from image I by image processing, generating image B by binarizing image K, and examining image I using image B, characterized in that generating image K comprises multiplying a high-pass convolution filtered image G(I) from image I and a first weight image W1. The present invention is also directed to an apparatus suitable for applying the method.

Abstract: A three dimensional measuring apparatus, provided for measuring a position of at least one contact element, applied on a surface of an electronic component, said apparatus comprising a first and a second camera, said first and second camera being each provided with a lens set-up, having an optical axis, said first and second camera being disposed at opposite sides with respect to a perpendicular axis on said surface of said component, in such a manner that their optical axis form each time an angle ?0° with respect to said perpendicular axis, said first and second camera each having an image field, provided for forming thereon a first, respectively a second image pattern of at least one of said contact elements, said first and second camera being connected with an image processor, provided for processing said image patterns formed in said image field by applying a perspective reconstruction on measurements, performed on said first and second image pattern, in order to determine, within a 3D reference frame, s

Abstract: Method and device for determining a position with respect to a reference plane of at least one lead of an electronic component, wherein said lead is illuminated from a first and respectively second position situated sideways and out of the plane wherein the electronic component is disposed and wherein a first and respectively a second shadow image is formed of at least a part of said lead on an image plane, which second position is different from said first position and wherein said first and respectively said second shadow image is located and a third and respectively a fourth position is determined to this end and said position is determined from said third and fourth position.