Abstract: Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.

Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

Abstract: The present invention is directed to a method for interconnecting two components. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels, extending in-plane with an average plane of the pad, so as to form at least two raised structures. The second interconnect component includes a second substrate and a set of metal pillars arranged on a main surface. The structured metal pads are bonded to a respective, opposite one of the metal pillars, using metal paste. The paste is sintered to form porous metal joints at the level of the channels. Metal interconnects are obtained between the substrates. During the bonding, the metal paste is sintered by exposing the structured metal pads and metal pillars to a reducing agent. The channels and raised structures improve the penetration of the reducing agent.

Abstract: The present invention is directed to a method for interconnecting two components. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels, extending in-plane with an average plane of the pad, so as to form at least two raised structures. The second interconnect component includes a second substrate and a set of metal pillars arranged on a main surface. The structured metal pads are bonded to a respective, opposite one of the metal pillars, using metal paste. The paste is sintered to form porous metal joints at the level of the channels. Metal interconnects are obtained between the substrates. During the bonding, the metal paste is sintered by exposing the structured metal pads and metal pillars to a reducing agent. The channels and raised structures improve the penetration of the reducing agent.