Abstract: Embodiments of a Coriolis-force-based flow sensing device and embodiments of methods for manufacturing embodiments of the Coriolis-force-based flow sensing device, comprising the steps of: forming a driving electrode; forming, on the driving electrode, a first sacrificial region; forming, on the first sacrificial region, a first structural portion with a second sacrificial region buried therein; forming openings for selectively etching the second sacrificial region; forming, within the openings, a porous layer having pores; removing the second sacrificial region through the pores of the porous layer, forming a buried channel; growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body; selectively removing the first sacrificial region thus suspending the structural body on the driving electrode.

Abstract: The MEMS gyroscope has a mobile mass carried by a supporting structure to move in a driving direction and in a first sensing direction, perpendicular to each other. A driving structure governs movement of the mobile mass in the driving direction at a driving frequency. A movement sensing structure is coupled to the mobile mass and detects the movement of the mobile mass in the sensing direction. A quadrature-injection structure is coupled to the mobile mass and causes a first and a second movement of the mobile mass in the sensing direction in a first calibration half-period and, respectively, a second calibration half-period. The movement-sensing structure supplies a sensing signal having an amplitude switching between a first and a second value that depend upon the movement of the mobile mass as a result of an external angular velocity and of the first and second quadrature movements.

Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.

Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

Abstract: A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.

Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.

Abstract: A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.

Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.