Patents by Inventor Luca Riva

Luca Riva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for the definition of openings in a dielectric layer
    Patent number: 6313040
    Abstract: A process for etching a dielectric layer, including the steps of forming, over the dielectric layer, a layer of polysilicon, forming over the layer of polysilicon a photoresist mask layer, etching the layer of polysilicon using the photoresist mask layer as an etching mask for selectively removing the layer of polysilicon, removing the photoresist mask layer from over the layer of polysilicon, etching the dielectric layer using the layer of polysilicon as a mask. Subsequently, the layer of polysilicon is converted into a layer of a transition metal silicide, and the layer of transition metal silicide is etched for selectively removing the latter from over the dielectric layer.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: November 6, 2001
    Assignee: STMicroelectronics S.r.l.
    Inventors: Lorena Beghin, Francesca Canali, Francesco Cazzaniga, Luca Riva, Carmelo Romeo