Abstract: A molded sensor assembly for measuring parameters in a given circumstance. The molded sensor assembly includes a housing with one or more apertures that extends from an upper surface to a lower surface of the housing. A lower surface of the housing is coupled to an upper surface of a printed circuit board member. A sensor is disposed within the housing, the sensor comprising wires that are coupled to the printed circuit board member. Each wire extends through an aperture of the housing.

Abstract: Devices used to sense physiologic blood parameters are disclosed. The devices may be configured to sense at least two physiologic blood parameters at substantially a common site of an extracorporeal perfusion circuit. The devices may include a pressure sensor and a temperature sensor. The temperature sensor may be in direct contact with the blood.

Abstract: A pressure port assembly and related components and methods are disclosed. In some instances, the pressure port assembly may comprise a pressure port body, including pressure port bodies composed of a continuous material. Pressure port bodies within the scope of this disclosure may be coupled to pressure sensing elements, including pressure transducers. Apertures or other flow paths may be provided across a pressure port body. Methods of integrally forming a pressure port body comprising a continuous material are also disclosed.

Abstract: Sensor assemblies and related components and methods are disclosed. In some instances, the sensor assemblies include a sensor mounting body and a porous member. The porous member can be disposed within an aperture that extends through a sensor mounting body. The porous member may function as a dampening element or snubber that impedes the propagation of one or more pressure waves across the aperture. Some assemblies may include a metallized layer.

Abstract: A pressure port assembly and related components and methods are disclosed. In some instances, the pressure port assembly may comprise a pressure port body, including pressure port bodies composed of a continuous material. Pressure port bodies within the scope of this disclosure may be coupled to pressure sensing elements, including pressure transducers. Apertures or other flow paths may be provided across a pressure port body. Methods of integrally forming a pressure port body comprising a continuous material are also disclosed.

Abstract: A pressure sensor has a sensor body at least partly formed with an electrically insulating material, particularly a ceramic material, defining a cavity facing on which is a diaphragm provided with an electric detector element, configured for detecting a bending of the diaphragm. The sensor body supports a circuit arrangement, including, a plurality of circuit components, among which is an integrated circuit, for treating a signal generated by the detection element. The circuit arrangement includes tracks made of electrically conductive material directly deposited on a surface of the sensor body made of electrically insulating material. The integrated circuit is made up of a die made of semiconductor material directly bonded onto the surface of the sensor body and the die is connected to respective tracks by means of wire bonding, i.e. by means of thin connecting wires made of electrically conductive material.

Abstract: A pressure sensor has a sensor body at least partly formed with an electrically insulating material, particularly a ceramic material, defining a cavity facing on which is a diaphragm provided with an electric detector element, configured for detecting a bending of the diaphragm. The sensor body supports a circuit arrangement, including, a plurality of circuit components, among which is an integrated circuit, for treating a signal generated by the detection element. The circuit arrangement includes tracks made of electrically conductive material directly deposited on a surface of the sensor body made of electrically insulating material. The integrated circuit is made up of a die made of semiconductor material directly bonded onto the surface of the sensor body and the die is connected to respective tracks by means of wire bonding, i.e. by means of thin connecting wires made of electrically conductive material.