Patents by Inventor Lucas B. Henderson

Lucas B. Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9165788
    Abstract: The methods and apparatus disclosed herein concern a process that may be referred to as a “soft anneal.” A soft anneal provides various benefits. Fundamentally, it reduces the internal stress in one or more silicon layers of a work piece. Typically, though not necessarily, the internal stress is a compressive stress. A particularly beneficial application of a soft anneal is in reduction of internal stress in a stack containing two or more layers of silicon. Often, the internal stress of a layer or group of layers in a stack is manifest as wafer bow. The soft anneal process can be used to reduce compressive bow in stacks containing silicon. The soft anneal process may be performed without causing the silicon in the stack to become activated.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: October 20, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Keith Fox, Bart J. Van Schravendijk, Dong Niu, Lucas B. Henderson, Joseph L. Womack
  • Publication number: 20130267081
    Abstract: The methods and apparatus disclosed herein concern a process that may be referred to as a “soft anneal.” A soft anneal provides various benefits. Fundamentally, it reduces the internal stress in one or more silicon layers of a work piece. Typically, though not necessarily, the internal stress is a compressive stress. A particularly beneficial application of a soft anneal is in reduction of internal stress in a stack containing two or more layers of silicon. Often, the internal stress of a layer or group of layers in a stack is manifest as wafer bow. The soft anneal process can be used to reduce compressive bow in stacks containing silicon. The soft anneal process may be performed without causing the silicon in the stack to become activated.
    Type: Application
    Filed: April 5, 2013
    Publication date: October 10, 2013
    Inventors: Keith Fox, Bart J. Van Schravendijk, Dong Niu, Lucas B. Henderson, Joseph L. Womack