Patents by Inventor Lucas DUPERREX

Lucas DUPERREX has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11557550
    Abstract: An electronic chip includes at least an electronic circuit disposed on a front face of a substrate; and an embrittlement structure comprising at least blind holes, each extending through a rear face of the substrate and a portion of the thickness of the substrate and each having a section, in a plane parallel to the rear face of the substrate, of surface area S and having a closed outer contour, the shape of which includes at least one radius of curvature R, such that S>?·R2.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: January 17, 2023
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Stephan Borel, Lucas Duperrex
  • Patent number: 11355456
    Abstract: Electronic chip comprising: an electronic circuit; a resistive element arranged on a rear face of a substrate; two conductive vias passing through the substrate, each connected to the electronic circuit and to one of the ends of the resistive element, and masked by the resistive element; and comprising a weakening structure formed of blind holes such that each of the blind holes comprises a section, at the rear face, of shape and of external dimensions similar to those of the conductive vias, and comprises a portion of the substrate masked by the resistive element, or in which the resistive element comprises first and second parts spaced apart from each other, arranged one above the other, electrically connected to each other and together forming a coil pattern and/or several alternating, intermingled, wound up or intertwined patterns.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: June 7, 2022
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Stephan Borel, Lucas Duperrex
  • Publication number: 20210050310
    Abstract: An electronic chip includes at least an electronic circuit disposed on a front face of a substrate; and an embrittlement structure comprising at least blind holes, each extending through a rear face of the substrate and a portion of the thickness of the substrate and each having a section, in a plane parallel to the rear face of the substrate, of surface area S and having a closed outer contour, the shape of which includes at least one radius of curvature R, such that S>?·R2.
    Type: Application
    Filed: January 23, 2019
    Publication date: February 18, 2021
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Stephan BOREL, Lucas DUPERREX
  • Publication number: 20190229073
    Abstract: Electronic chip comprising: an electronic circuit; a resistive element arranged on a rear face of a substrate; two conductive vias passing through the substrate, each connected to the electronic circuit and to one of the ends of the resistive element, and masked by the resistive element; and comprising a weakening structure formed of blind holes such that each of the blind holes comprises a section, at the rear face, of shape and of external dimensions similar to those of the conductive vias, and comprises a portion of the substrate masked by the resistive element, or in which the resistive element comprises first and second parts spaced apart from each other, arranged one above the other, electrically connected to each other and together forming a coil pattern and/or several alternating, intermingled, wound up or intertwined patterns.
    Type: Application
    Filed: January 23, 2019
    Publication date: July 25, 2019
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Stephan BOREL, Lucas DUPERREX