Patents by Inventor Lucas Paul Keranen
Lucas Paul Keranen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10241017Abstract: A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.Type: GrantFiled: November 28, 2012Date of Patent: March 26, 2019Assignee: Bruker Nano, Inc.Inventors: Lucas Paul Keranen, Syed Amanulla Syed Asif, Ryan Major, Yunje Oh
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Patent number: 9829417Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.Type: GrantFiled: March 14, 2013Date of Patent: November 28, 2017Assignee: Hysitron, Inc.Inventors: Roger William Schmitz, Ude D. Hangen, Lucas Paul Keranen, Ryan Major, Yunje Oh, Jeremiah Vieregge, Christopher David Young
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Patent number: 9804072Abstract: A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.Type: GrantFiled: November 28, 2012Date of Patent: October 31, 2017Assignee: Hysitron, Inc.Inventors: Syed Amanulla Syed Asif, Edward Cyrankowski, Lucas Paul Keranen, Ryan Major, Yunje Oh, Oden Lee Warren, Maciej W. Misiak
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Patent number: 9194727Abstract: A method of calibrating a mechanical instrument assembly includes reading a memory device coupled with a mechanical testing instrument, the mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument, and reading includes reading of one or more calibration values based on the one or more mechanical characteristic values. The method further includes calibrating the mechanical instrument assembly according to the one or more calibration values. The mechanical testing instrument is coupled with the mechanical instrument assembly.Type: GrantFiled: November 23, 2011Date of Patent: November 24, 2015Assignee: Hysitron, Inc.Inventors: Christopher David Young, Daniel Paul Carlson, Lucas Paul Keranen, Jeffrey P. Schirer
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Publication number: 20150185117Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.Type: ApplicationFiled: March 14, 2013Publication date: July 2, 2015Applicant: Hysitron, Inc.Inventors: Roger William Schmitz, Ude D. Hangen, Lucas Paul Keranen, Ryan Major, Yunje Oh, Jeremiah Vieregge, Christopher David Young
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Patent number: 8959980Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: GrantFiled: August 8, 2013Date of Patent: February 24, 2015Assignee: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Publication number: 20150033835Abstract: A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.Type: ApplicationFiled: November 28, 2012Publication date: February 5, 2015Inventors: Syed Amanulla Syed Asif, Edward Cyrankowski, Lucas Paul Keranen, Ryan Major, Yunjie Oh, Oden Lee Warren
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Patent number: 8939041Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: GrantFiled: February 10, 2012Date of Patent: January 27, 2015Assignee: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Publication number: 20140331782Abstract: A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.Type: ApplicationFiled: November 28, 2012Publication date: November 13, 2014Inventors: Lucas Paul Keranen, Syed Amanulla Syed Asif, Ryan Major, Yunje Oh
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Publication number: 20140293293Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: ApplicationFiled: February 10, 2012Publication date: October 2, 2014Applicant: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Patent number: 8770036Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: GrantFiled: August 8, 2013Date of Patent: July 8, 2014Assignee: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Patent number: 8631687Abstract: An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.Type: GrantFiled: April 19, 2011Date of Patent: January 21, 2014Assignee: Hysitron, Inc.Inventors: Justin D. Patten, Christopher David Young, Lucas Paul Keranen
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Publication number: 20130332100Abstract: A method of calibrating a mechanical instrument assembly includes reading a memory device coupled with a mechanical testing instrument, the mechanical testing instrument having one or more mechanical characteristics with values unique to the mechanical testing instrument, and reading includes reading of one or more calibration values based on the one or more mechanical characteristic values. The method further includes calibrating the mechanical instrument assembly according to the one or more calibration values. The mechanical testing instrument is coupled with the mechanical instrument assembly.Type: ApplicationFiled: November 23, 2011Publication date: December 12, 2013Inventors: Christopher David Young, Daniel Paul Carlson, Lucas Paul Keranen, Jeffrey P. Schirer
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Publication number: 20130319071Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: ApplicationFiled: August 8, 2013Publication date: December 5, 2013Applicant: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Publication number: 20130319127Abstract: An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.Type: ApplicationFiled: August 8, 2013Publication date: December 5, 2013Applicant: Hysitron, Inc.Inventors: David James Vodnick, Arpit Dwivedi, Lucas Paul Keranen, Michael David Okerlund, Roger William Schmitz, Oden Lee Warren, Christopher David Young
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Publication number: 20110252874Abstract: An indentation assembly for sub-micron testing includes an indentation tip and a tip holder coupled with the indentation tip. The tip holder includes a first thermal conductivity and a first coefficient of thermal expansion. A tip holder mount configured for coupling with a transducer and the tip holder, the tip holder mount having a second thermal conductivity greater than the first thermal conductivity, and the tip holder mount has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. The tip holder mount has a mount length, and the tip holder further has a tip holder length greater that the mount length. The tip holder remotely positions the tip holder mount relative to the indentation tip. The tip holder length, volume and the first thermal conductivity cooperate to throttle heat transfer through the tip holder prior to reaching the tip holder mount.Type: ApplicationFiled: April 19, 2011Publication date: October 20, 2011Applicant: HYSITRON, INC.Inventors: Justin D. Patten, Christopher David Young, Lucas Paul Keranen