Patents by Inventor Lucas Restrepo

Lucas Restrepo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11419753
    Abstract: A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: August 23, 2022
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Julio L. Vergara, Andrew Padula, Lucas Restrepo
  • Patent number: 10449726
    Abstract: A method for reinforcing joints between one or more components is presented. Adhesive is applied to joint areas of contact between the components and the components are stitched together at the joint areas to ensure that the joints are mechanically stable enough to withstand stresses such as pressurization and external manipulation.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: October 22, 2019
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Julio Vergara, Andrew Padula, Lucas Restrepo
  • Publication number: 20180098903
    Abstract: A heat exchanger module (HEM) and system uses a flexible substrate with one or more open channels, to which a substrate cover is bonded, thereby forming closed channels in the flexible substrate. Thermoelectric coolers (TECs) are attached to optional thermally diffusing copper squares atop the substrate cover. An interface cover is attached to the TEC tops, with a compliant thermally conductive material opposite the TECs and ultimately in contact with a patient. A liquid is passed through the closed channels, which act as thermal references for the TECs. Current is supplied by a controller to the TECs to induce TEC cooling or heating relative to the liquid. One or more temperature sensors detect the temperature of the interface cover, which are used as inputs to the control of the TEC supply current. The HEM may be used for heating, cooling, or cycling between heating and cooling for various medical uses.
    Type: Application
    Filed: September 26, 2017
    Publication date: April 12, 2018
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Julio L. Vergara, Andrew Padula, Lucas Restrepo
  • Publication number: 20170190102
    Abstract: A method for reinforcing joints between one or more components is presented. Adhesive is applied to joint areas of contact between the components and the components are stitched together at the joint areas to ensure that the joints are mechanically stable enough to withstand stresses such as pressurization and external manipulation.
    Type: Application
    Filed: January 16, 2017
    Publication date: July 6, 2017
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Julio Vergara, Andrew Padula, Lucas Restrepo
  • Publication number: 20160270952
    Abstract: A therapeutic craniocervical hypothermia device which provides controlled cooling (heating) through a helmet and collar. The helmet and collar contain a plurality of distributed thermoelectric cooling devices (TECs) distributed on a helmet structure and a liquid coolant system for exchanging heat external to the helmet and collar to keep the TECs operating efficiently. A control circuit drives the TECs in response to measurements from a plurality of temperature sensors held adjacent the patient wearing the helmet and collar. In at least one embodiment, the TECs are grouped within interconnected flexible modules which each contain internal cooling passageways adjacent the TECs.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 22, 2016
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Julio L. Vergara, Raul Serrano Carmona, Lucas Restrepo