Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract: A method for achieving mechanical and electrical interconnection of first and second bodies of which the first has at least one conductive element its surface intended to face the second and the second has a through-hole for electrical connection provided with a metallic coating intended for electrical connections to the conductive element of the first body includes applying layers of vitreous glue to corresponding surface portions of the first and second bodies. Moreover, a coating of conductive material in a vitreous matrix is deposited by the thick film technique on the surface of the second body intended to face the first, adjacent the through hole with the coating extending at least partly into the hole and electrically connected to the metallic coating of this hole. The bodies are then joined bring the respective layers of glue into contact with each other and the conductive coating of the second body into contact with the conductive element of the first.