Abstract: A UV curable electrically conductive adhesive has been developed with low resistivity, adequate lap shear strength, good thermal stability, and very stable conductivity at high temperatures of about 100.degree. C. and high humidity. The adhesive may be applied by silk screen printing and cured by UV in about 8 seconds. The adhesive may also be used as a replacement of solder in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of (A) a blend of an acrylate epoxy and a urethane, a copolymer of an acrylate epoxy and a urethane, or mixtures thereof; (B) a polyfunctional acrylate monomer; (C) a photoinitiator, and (D) a conductive filler. Optionally, adhesion promoters and flow control agents may be used.

Abstract: A system which utilizes a source of ultraviolet radiation to mark a surface or to cure selectively a photosensitive paint applied to a surface. The source of UV light is either a laser or a broadband source and the light is controlled by an aperture and/or a stencil apparatus. The photosensitive paint is applied by a controlled technique as a protective or a decorative coating.

Abstract: Disclosed is a method of making a printed circuit board by exposing in a circuit pattern the polymeric surface of a conductive substrate coated with a polymer selected from the group consisting of polyimides, polyamide-imides, polyester-amide-imides, polysulfones, polyphenylene sulfides, and polyphenylene oxides, to an ion beam at an energy of about 50 KeV to about 2 MeV and a fluence of about 10.sup.15 to 10.sup.18 ions/cm.sup.2. The surface is then wet blasted and the portions of the polymeric surface that have been exposed to the ion beam are electrolessly plated with a metal such as nickel or copper. Also disclosed is a coated substrate comprising a metal or conductive surface and an imide polymeric coating on the surface which can be electrophoretically deposited, a portion of which has been exposed to an ion beam.

Abstract: Disclosed is a method of making a laminate by electrophoretically coating a flat mat made from a material selected from graphite, carbon, and mixtures thereof with an electrophoretable polymer in a non-aqueous system. The polymer is cured and the mat is impregnated with a thermosetable impregnating resin. The impregnating resin is B-staged to form a prepreg and several prepregs are stacked and cured under heat and pressure to form the laminate. Also disclosed is a laminate made by this method.

Abstract: Disclosed is a method of electrophoretically depositing a coating of polysulfones or polyethersulfones on a conductive substrate. An amine-free solution is formed in an organic solvent of the polysulfones or polyethersulfones. An emulsion is formed by combining the solution with an organic non-solvent for the polymer which contains up to about 0.6 parts by weight of an organic nitrogen containing base per parts by weight of the polymer. A direct current is applied between a conductive substrate and the emulsion which results in the deposition of the polymer on the substrate.

Abstract: Disclosed is an electrodepositable emulsion which comprises a soluble un-ionized polymer containing an amic acid or amide linking group, a non-electrolyzable organic solvent for the polymer and a non-electrolyzable organic non-solvent for the polymer. The weight ratio of the solvent to the non-solvent is about 0.1 to about 0.5 and the polymer is about 0.4 to about 5% by weight of the weight of the solvent. No amine or surface active agent is used. A workpiece is coated with the polymer by placing it into the emulsion about one-half to about two inches away from the cathode. Constant dc voltage is applied between the cathode and the workpiece until a coating of a desired thickness has been deposited on the workpiece. The workpiece is then removed, dried, and cured.

Abstract: An emulsion is prepared which comprises about 8 to about 20 percent of a solvent, about 0.5 to 5 percent of an epoxy resin dissolved in the solvent to form a discontinuous phase, about 75 to about 90 percent of a precipitant as the continuous phase, and an emulsifier in an amount sufficient to react stoichiometrically with the epoxy and hydroxyl groups on the epoxy resin up to about 900% in excess of stoichiometric. A conductive workpiece is placed in the emulsion about 1/2 to about 2 inches from an electrode which is also immersed in the emulsion. A direct electric current potential is applied between the workpiece and the electrode with the workpiece as the anode. About 50 to about 400 volts and about 2 to about 50 milliamperes are used until a coating of the desired thickness has been deposited on the workpiece. The solvent and precipitant are preferably ketones such as cyclohexanone, and methylethylketone or isobutylketone, respectively.

Abstract: An imide containing polymeric coating is electrophoretically formed on wire from an emulsion. The emulsion contains a polymer, an organic aprotic solvent for the polymer, an amine, and a polar precipitant in which the polymer is insoluble. The wire is passed through a conductive tube immersed in the solvent while a D.C. current is applied between the tube and the wire. The polymer coating on the wire is then cured.

Abstract: Wire is cleaned by passing it through an electrolytic cleaner then through an ultrasonic rinse. The electrolytic cleaner comprises a graphite tube through which the wire passes, an alkaline aqueous solution between the wire and the graphite tube, and an electric current, at least half D.C., between the wire and the graphite tube.

Abstract: A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non-aqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.

Abstract: A conducting, non-aqueous, colloidal, polysulfone electrodeposition composition is made by mixing: (1) 1 part polysulfone polymer and 20-37 parts non-aqueous, organic, aprotic solvent for the polysulfone polymer with (2) 0.8-1.2 parts of a nitrogen containing base, to form a polysulfone polymer solution, which is added to (3) 25-150 parts of a non-aqueous, non-solvent for the polysulfone polymer, which is miscible with the aprotic solvent.

Abstract: A method of casting ultra-thin semipermeable membranes comprises the steps of: (A) applying a coating of a film forming water soluble solution, containing a leachable pore producing agent and a polymer which is not substantially degraded by organic polar solvents, onto a smooth casting surface, (B) drying the coating to form a support film about 0.5-10 mils thick, (C) applying a coating of an organic polymeric membrane coating solution onto the support film, and drying the coating to form a semipermeable reverse osmosis membrane film about 0.01-1.0 mil thick and (D) applying a leaching liquid to the films, to cause pore formation in the support film and to form a composite consisting of a 0.01-1.0 mil thick semipermeable membrane, supported by a 0.5-10 mils thick water soluble film support of between about 5-50% porosity.

Abstract: A flexible substrate having a caustic resistant support and at least one membrane comprising a solid polymeric matrix containing a network of interconnected pores and interdispersed inorganic filler particles with a ratio of filler: polymer in the polymeric matrix of between about 1:1 to 5:1, is made by coating at least one side of the support with a filler:coating formulation mixture of inorganic filler particles and a caustic resistant, water insoluble polymer dissolved in an organic solvent, and removing the solvent from the mixture to provide a porous network within the polymeric matrix.