Abstract: The invention relates to the encapsulation of a seminconductor component in a plastic box.The fitting assembly comprises a radiator plate, a ceramic plate, a copper counter-electrode, a semiconductor pellet, a connecting pin with its end bent back and welded to the counter-electrode, whereby the latter is much larger than the pellet and occupies almost the entire surface of the ceramic plate. The ends of the other connecitng pins are bent back above the metallized zones of the upper pellet surface. Fiting takes place in a positioner machined in the form of successive cups with decreasing dimensions, in order to produce a welded stack having all the above elements, except the connecting pins, which are subsequently welded to the stack once the latter has been extracted from the positioner.

Abstract: A surface contact electrical component having two cylindrical, exposed, conductive end caps and a plastic body therebetween. The body has substantially planar upper and lower faces. The separation of the upper and lower faces is slightly less than the diameter of the end caps so that a layer of glue may be placed between the body and a printed circuit board when the end caps are in contact with the printed circuit board.

Abstract: A chip carrier is provided for power components operating at high frequency, comprising a main heat conducting body with a cavity in which said component is housed, and forced flow fluid ducts. The chip carrier is inserted in a window cut out in a printed circuit board. A projecting flange bears against the edge of the window, whereas flat electrodes, extending from the carrier in the same plane as the flange, bear against connections printed on the board. Below the board, the cooling fluid forced flow channels are connected to delivery and discharge ducts.