Abstract: A carrier having a plurality of transport channels arranged in stacked parallel relationship for receiving semiconductive wafers is provided with a pair of oppositely facing recessed regions extending partially into the transport channels. In each of these recessed regions a separate spring-loaded stop member is pivotally mounted for automatic movement to a raised inoperative position, where itis pivoted out of the transport channels to permit passage of the semiconductive wafers therethrough, when the carrier is set down, and for automatic movement to a lowered operative position, where it is pivoted into the transport channels to block passage of the semiconductive wafers therethrough and thereby impede spillage of any semiconductive wafers contained in the carrier, when the carrier is picked up.

Abstract: An electrical circuit structure formed by bonding an integrated circuit, which has a plurality of conductive leads formed substantially coplanar with one surface of the semiconductor integrated circuit chip, to a pattern of conductive lines formed on the surface of a substrate having an insulating surface by positioning the leads adjacent the surface of the substrate supporting the conductive lines with portions of the conductive leads overlapping portions of the conductive lines and bonding said portions together by welding while exerting a substantially uniform weld deformation pressure on each of said conductive lead portions to deform said conductive lead portions to a predetermined degree.