Patents by Inventor Ludan Huang
Ludan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11208732Abstract: Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.Type: GrantFiled: September 6, 2019Date of Patent: December 28, 2021Assignee: Lam Research CorporationInventors: Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan David Reid, Manish Ranjan, Bryan Pennington, Clifford Raymond Berry
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Publication number: 20210366768Abstract: Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substrate wettability includes placing a substrate in a pre-treatment chamber, controlling an environment of the pre-treatment chamber to moisturize a surface of the substrate; and placing the substrate into a plating cell. Other methods and systems are disclosed.Type: ApplicationFiled: April 29, 2019Publication date: November 25, 2021Inventors: Zhian HE, Shantinath GHONGADI, Hyungjun HUR, Ludan HUANG, Jingbin FENG, Douglas HILL, Thomas BURKE, Manish RANJAN, Andrew James PFAU
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Publication number: 20190390361Abstract: Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.Type: ApplicationFiled: September 6, 2019Publication date: December 26, 2019Inventors: Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan David Reid, Manish Ranjan, Bryan Pennington, Clifford Raymond Berry
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Patent number: 10443146Abstract: Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.Type: GrantFiled: March 30, 2017Date of Patent: October 15, 2019Assignee: Lam Research CorporationInventors: Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan David Reid, Manish Ranjan, Bryan Pennington, Clifford Raymond Berry
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Publication number: 20180282894Abstract: Methods and apparatus for determining whether a substrate includes an unacceptably high amount of oxide on its surface are described. The substrate is typically a substrate that is to be electroplated. The determination may be made directly in an electroplating apparatus, during an initial portion of an electroplating process. The determination may involve immersing the substrate in electrolyte with a particular applied voltage or applied current provided during or soon after immersion, and recording a current response or voltage response over this same timeframe. The applied current or applied voltage may be zero or non-zero. By comparing the current response or voltage response to a threshold current, threshold voltage, or threshold time, it can be determined whether the substrate included an unacceptably high amount of oxide on its surface. The threshold current, threshold voltage, and/or threshold time may be selected based on a calibration procedure.Type: ApplicationFiled: March 30, 2017Publication date: October 4, 2018Inventors: Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Jonathan David Reid, Manish Ranjan, Bryan Pennington, Clifford Raymond Berry
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Publication number: 20180030611Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.Type: ApplicationFiled: October 11, 2017Publication date: February 1, 2018Inventors: Tighe A. Spurlin, Charles Lorenzo Merrill, Ludan Huang, Matthew Sherman Thorum, Lee J. Brogan, James E. Duncan, Frederick Dean Wilmot, Robert Marshall Stowell, Steven T. Mayer, Haiying Fu, David W. Porter, Shantinath Ghongadi, Jonathan David Reid, Hyosang S. Lee, Mark J. Willey
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Patent number: 9816196Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.Type: GrantFiled: April 24, 2013Date of Patent: November 14, 2017Assignee: Novellus Systems, Inc.Inventors: Tighe A. Spurlin, Charles L. Merrill, Ludan Huang, Matthew Thorum, Lee Brogan, James E. Duncan, Frederick D. Wilmot, Robert Marshall Stowell, Steven T. Mayer, Haiying Fu, David W. Porter, Shantinath Ghongadi, Jonathan D. Reid, Hyosang S. Lee, Mark J. Willey
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Patent number: 9677190Abstract: Certain embodiments disclosed herein pertain to methods and apparatus for electrodepositing material on a substrate. More particularly, a novel membrane for separating the anode from the cathode/substrate, and a method of using such a membrane are presented. The membrane includes at least an ion exchange layer and a charge separation layer. The disclosed embodiments are beneficial for maintaining relatively constant concentrations of species in the electrolyte over time, especially during idle (i.e., non-electroplating) times.Type: GrantFiled: April 18, 2014Date of Patent: June 13, 2017Assignee: Lam Research CorporationInventors: Doyeon Kim, Shantinath Ghongadi, Yuichi Takada, Ludan Huang, Tariq Majid
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Publication number: 20160111342Abstract: Method and apparatus for characterizing metal oxide reduction using metal oxide films formed by exposure to an oxygen plasma are disclosed. A substrate including a metal seed layer is exposed to the oxygen plasma to form a metal oxide of the metal seed layer, where the exposure can take place at a low temperature and low pressure. Oxidized substrates formed in this manner provide metal oxides that are repeatable, uniform, and stable. The oxidized substrates can be stored for later use or exposed to a reducing treatment to the metal oxide to metal. In some implementations, exposure to the reducing treatment includes exposure to plasma of a reducing gas species, where the plasma of the reducing gas species and the oxygen plasma can both be produced in a remote plasma source.Type: ApplicationFiled: October 15, 2015Publication date: April 21, 2016Inventors: Ludan Huang, Richard K. Lyons, Shantinath Ghonghadi, Tighe A. Spurlin, Edward C. Opocensky
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Publication number: 20150122658Abstract: Certain embodiments disclosed herein pertain to methods and apparatus for electrodepositing material on a substrate. More particularly, a novel membrane for separating the anode from the cathode/substrate, and a method of using such a membrane are presented. The membrane includes at least an ion exchange layer and a charge separation layer. The disclosed embodiments are beneficial for maintaining relatively constant concentrations of species in the electrolyte over time, especially during idle (i.e., non-electroplating) times.Type: ApplicationFiled: April 18, 2014Publication date: May 7, 2015Applicant: Lam Research CorporationInventors: Doyeon Kim, Shantinath Ghongadi, Yuichi Takada, Ludan Huang, Tariq Majid
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Publication number: 20140001050Abstract: Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.Type: ApplicationFiled: June 18, 2013Publication date: January 2, 2014Inventors: Ludan Huang, Khuong Nguyen, Haiying Fu, Charles L. Merrill, Shantinath Ghongadi
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Patent number: 8598567Abstract: Photoconductive optoelectronic devices, such as photodetectors and photovoltaics, are provided. The devices are sensitized to a particular wavelength (or range of wavelengths) of electromagnetic radiation such that the devices provide increased performance efficiency (e.g., external quantum efficiency) at the wavelength. The devices include a photoconductive semiconductor layer spanning an electrode gap between two electrodes to provide a photoconductive electrical conduit. Abutting the semiconductor layer is a plurality of plasmonic nanoparticles. The improved efficiency of the devices results from wavelength-dependent plasmonic enhancement of device photosensitivity by the plasmonic nanoparticles.Type: GrantFiled: May 17, 2011Date of Patent: December 3, 2013Assignee: University of Washington through its Center for CommercializationInventors: Ludan Huang, Lih Y. Lin
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Publication number: 20130284604Abstract: Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Inventors: Tighe A. Spurlin, Charles L. Merrill, Ludan Huang, Matthew Thorum, Lee Brogan, James E. Duncan, Frederick D. Wilmot, Marshall R. Stowell, Steven T. Mayer, Haiying Fu, David W. Porter, Shantinath Ghongadi, Jonathan D. Reid, Hyosang S. Lee, Mark J. Willey
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Publication number: 20110278541Abstract: Photoconductive optoelectronic devices, such as photodetectors and photovoltaics, are provided. The devices are sensitized to a particular wavelength (or range of wavelengths) of electromagnetic radiation such that the devices provide increased performance efficiency (e.g., external quantum efficiency) at the wavelength. The devices include a photoconductive semiconductor layer spanning an electrode gap between two electrodes to provide a photoconductive electrical conduit. Abutting the semiconductor layer is a plurality of plasmonic nanoparticles. The improved efficiency of the devices results from wavelength-dependent plasmonic enhancement of device photosensitivity by the plasmonic nanoparticles.Type: ApplicationFiled: May 17, 2011Publication date: November 17, 2011Applicant: University of Washington through its Center for CommercializationInventors: Ludan Huang, Lih Y. Lin