Abstract: An enzymatically catalyzed method for producing L-glufosinate or a phosphoester of L-glufosinate can be performed. An activated L-homoserine HA is reacted with a substrate S selected from methylphosphinic acid and the esters of methylphosphinic acid. The method makes accessible new substrates in the enzymatic production of L-glufosinate and its phosphoesters.

Abstract: A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

Abstract: Methods and apparatuses are disclosed for laser processing. A method includes providing a laser beam transparent to a workpiece. A cover, having a surface quality better than the workpiece's surface, is provided and spaced apart from the workpiece's surface. A fluid is provided between and in contact with the cover and the workpiece's surface. A laser beam is directed through the cover and fluid to the workpiece. An apparatus includes a cover spaced apart from a workpiece's surface and including a surface quality better than the workpiece's surface, a fluid dispenser for introducing fluid between and in contact with the cover and the workpiece's surface, and a laser system that directs a laser beam through the cover and fluid to the workpiece.

Abstract: A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

Abstract: A method for cutting and separating an item from a workpiece made of a brittle material is disclosed. The method uses straight and circular release features that are arranged to cause controlled cracking in scrap material close to each inside curve in the outline of the item. A first pulsed laser-beam weakens material along the outline of the item and along the release features. A second laser-beam selectively heats the release features for sufficient time to cause melting and deformation, thereby initiating the controlled cracking.

Abstract: A method for singulating a group of semiconductor packages containing a plastic molded body. The singulation of the semiconductor packages is effected along a predetermined separation area, wherein, in the predetermined separation area, a metallic layer extending over at least a partial section of the predetermined separation area has to be cut through in addition to a plastic layer formed of a material of the molded body. The method includes the steps of: making a groove into the predetermined separation area of the semiconductor packages by laser engraving, wherein at least a part of the metallic layer extending in the predetermined singulation area is removed, and subsequent separation of the semiconductor packages by mechanical sawing cut along the predetermined separation area.