Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

Abstract: A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A test system for testing electrical connections, especially soldered connections, between electronic components and a circuit board to be tested, characterized in that the test system has a communication interface, which by contacting the circuit board enables a data exchange with a data memory or a communication module of the circuit board to be tested, wherein the communication interface is arranged within a housing of the test system freely movably in at least two spatial directions, preferably three spatial directions.

Abstract: A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

Abstract: A test system (1) for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board (6) to be tested, characterized in that the test system (1) includes a subassembly, which is movably mounted in a housing (1a) of the test system, and a current and/or voltage source (14) for energizing the circuit board (6) to be tested, the current and/or voltage source (14) being arranged in the housing (1a) of the test system (1) in such a way as to be movable in at least two directions in space.

Abstract: Disclosed is a test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

Abstract: A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.