Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.

Abstract: A method of testing one or more optoelectronic devices located on respective device coupons. The device coupon(s) are present on a wafer. The method comprises: testing the or each optoelectronic device using a corresponding testing element, the testing element(s) being located on the same wafer as the device coupon(s), by either: in a first testing protocol, operating the optoelectronic device so as to produce an optical output, and detecting the light incident on the testing element from the optoelectronic device under test, or in a second testing protocol, detecting, by the optoelectronic device under test, the light received from the testing element.

Abstract: A coupon wafer for a micro-transfer printing process. The coupon wafer including a device coupon attached to a substrate of the coupon wafer by one or more tethers; wherein the or each tether is a pillar extending at least partially through the device coupon to contact the substrate of the coupon wafer.

Abstract: An optoelectronic device. The optoelectronic device comprising: a plurality of waveguide ridges provided in an array, each waveguide ridge extending away from a semiconductor bed; a plurality of upper contacts, each electrically connected to an upper surface of a respective waveguide ridge, said upper surface being located distal from the semiconductor bed; and a plurality of lower contacts, each located between a respective pair of waveguide ridges and electrically connected to the semiconductor bed.

Abstract: A method of preparing a device coupon for a micro-transfer printing process from a multi-layered stack located on a device wafer substrate. The multi-layered stack comprises a plurality of semiconductor layers. The method comprises steps of: (a) etching the multi-layered stack to form a multi-layered device coupon, including an optical component; and (b) etching a semiconductor layer of the multi-layered device coupon to form one or more tethers, said tethers securing the multi-layered device coupon to one or more supports.

Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.

Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.

Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.

Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.