Patents by Inventor Ludovic SALLET

Ludovic SALLET has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11078004
    Abstract: A multilayer film: an adhesive layer A: an extrudable hot-melt self-adhesive composition; a complexable thin layer B; and a heat-sealable and cleavable layer C of a linear copolyester C1 obtained by polycondensation of a composition of monomers: at least one diol (i), at least one compound (ii) chosen from terephthalic acid or a diester derivative and at least one compound (iii) chosen from an aromatic or aliphatic dicarboxylic acid or a diester or anhydride derivative; the amounts of the monomers (i), (ii) and (iii) used in the polycondensation such that the softening temperature of C1 is below 190° C. A process for producing the multilayer film by co-extrusion blow-molding. A resealable packaging comprising a PET-based receptacle and a seal of said multilayer film, the heat-sealable and cleavable layer (C) of which is heat-sealed on the receptacle.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: August 3, 2021
    Assignee: BOSTIK SA
    Inventors: Christophe Robert, Marc Brestaz, Ludovic Sallet, Jeremie Peyras-Carratte
  • Publication number: 20180215522
    Abstract: A multilayer film: an adhesive layer A: an extrudable hot-melt self-adhesive composition; a complexable thin layer B; and a heat-sealable and cleavable layer C of a linear copolyester C1 obtained by polycondensation of a composition of monomers: at least one diol (i), at least one compound (ii) chosen from terephthalic acid or a diester derivative and at least one compound (iii) chosen from an aromatic or aliphatic dicarboxylic acid or a diester or anhydride derivative; the amounts of the monomers (i), (ii) and (iii) used in the polycondensation such that the softening temperature of C1 is below 190° C. A process for producing the multilayer film by co-extrusion blow-molding. A resealable packaging comprising a PET-based receptacle and a seal of said multilayer film, the heat-sealable and cleavable layer (C) of which is heat-sealed on the receptacle.
    Type: Application
    Filed: July 12, 2016
    Publication date: August 2, 2018
    Applicant: BOSTIK SA
    Inventors: Christophe ROBERT, Marc BRESTAZ, Ludovic SALLET, Jeremie PEYRAS-CARRATTE
  • Patent number: 10000043
    Abstract: Multilayer film comprising two thin layers D and E of a thermoplastic material bonded to one another by a continuous layer A that is a hot-melt pressure-sensitive adhesive composition: a composition of styrene block copolymers (a mixture of diblock and triblock copolymers); and one or more tackifying resins with a softening temperature of 5 to 140° C.; the adhesive layer A connected to the layer D via a tie layer B, and connected to the layer E via a tie layer C, B and C being polyethylene or polypropylene modified by a cyclic anhydride of an unsaturated acid having from 4 to 8 carbon atoms, manufacture of the film by coextrusion, and Use of the film for resealable packagings.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: June 19, 2018
    Assignee: BOSTIK SA
    Inventors: Christophe Robert, Christophe Notteau, Ludovic Sallet
  • Publication number: 20150336362
    Abstract: Multilayer film comprising two thin layers D and E of a thermoplastic material bonded to one another by a continuous layer A that is a hot-melt pressure-sensitive adhesive composition: a composition of styrene block copolymers (a mixture of diblock and triblock copolymers); and one or more tackifying resins with a softening temperature of 5 to 140° C.; the adhesive layer A connected to the layer D via a tie layer B, and connected to the layer E via a tie layer C, B and C being polyethylene or polypropylene modified by a cyclic anhydride of an unsaturated acid having from 4 to 8 carbon atoms, manufacture of the film by coextrusion, and Use of the film for resealable packagings.
    Type: Application
    Filed: May 21, 2015
    Publication date: November 26, 2015
    Applicant: BOSTIK SA
    Inventors: Christophe ROBERT, Christophe NOTTEAU, Ludovic SALLET