Patents by Inventor Ludovicus Megens

Ludovicus Megens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting electrical and/or electronic components of a printed circuit board
    Patent number: 5144535
    Abstract: A method of mounting SMD components (6, 7, 8) and wire components (21, 22) on a printed circuit board (2), in which the wire components (21, 22) ae secured on the printed circuit board (2) by means of connection elements (13, 14). The SMD components (6, 7, 8) and the connection elements (13, 14) are secured by reflow soldering on the printed circuit board (2), while the wire components (21, 22) are connected by their connection wires (19, 20) to the connection elements (13, 14) by welding.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: September 1, 1992
    Assignee: U.S. Philips Corporation
    Inventors: Ludovicus Megens, Petrus H. A. A. Vriens, George A. A. Asselman, Gerardus Notenboom
  • Method of mounting electrical and/or electronic components on a single-sided printed board
    Patent number: 4982376
    Abstract: Hollow lead connection elements are placed in through holes in a one-side printed circuit board and are reflow soldered to the conductors with SMD devices on the conductor side of the board. Components are positioned on the conductor side with their leads passed through the connection elements. The leads are wave soldered to the elements on the side of the board opposite the conductors. The elements may have spring-loaded tongues for securing the leads thereto prior to soldering and a flange on the conductor side of the board.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: January 1, 1991
    Assignee: U.S. Philips Corporation
    Inventors: Ludovicus Megens, Petrus Vriens